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Semiconductor laser device and optical pickup device having the device

An optical pickup device, laser device technology, applied in the direction of semiconductor lasers, semiconductor devices, semiconductor/solid-state device components, etc., can solve problems such as deterioration, deterioration of recording and reproduction characteristics, off-axis aberration, etc., to prevent the recording and reproduction characteristics. Effect

Inactive Publication Date: 2006-03-15
SHARP KK
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0031] However, when the inclination adjustment in the θ| direction of the above-mentioned semiconductor laser device is performed, the optical axis of the incident laser light to the collimator lens and the objective lens is inclined due to the position of the light-emitting point of the LD chip 1802, and an off-axis aberration occurs. As a result, recording and reproduction characteristics deteriorate
That is, when the inclination in the θ∥ direction of the above-mentioned semiconductor laser device is adjusted, the deterioration of the recording and reproduction characteristics cannot be avoided.

Method used

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  • Semiconductor laser device and optical pickup device having the device
  • Semiconductor laser device and optical pickup device having the device
  • Semiconductor laser device and optical pickup device having the device

Examples

Experimental program
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no. 1 example

[0119] figure 1 It is a schematic diagram showing the main part of the optical pickup device according to the first embodiment of the present invention viewed obliquely from above.

[0120] The optical pickup device has a semiconductor laser device 100 and a housing 151 having a mounting surface 151 a on which the semiconductor laser device 100 is mounted.

[0121] The semiconductor laser device 100 includes a thin metal plate 101 having a substantially rectangular plate shape as an example of a metal plate having a mounting surface 101a, and an LD chip 102 as an example of a semiconductor laser element having a front end surface 102a for emitting laser light.

[0122] The LD chip 102 is fixed to the front end portion of the mounting surface 101 a of the thin metal plate 101 with a material having excellent thermal conductivity such as indium or silver paste. In addition, the layer thickness direction of the layers constituting the LD chip 102 is parallel to the Y-axis direc...

no. 2 example

[0132] image 3 It is a schematic diagram showing the main part of the optical pickup device according to the second embodiment of the present invention viewed obliquely from above. in addition, image 3 in, with figure 1 , figure 2 The same structural part as that of the first embodiment shown is used with figure 1 , figure 2 The same reference symbols are used for the structural parts, and descriptions thereof are omitted.

[0133] The optical pickup device includes a semiconductor laser device 100 and a housing 251 having a mounting surface 251 a on which the semiconductor laser device 100 is mounted.

[0134]A guide portion 252 having an upper surface higher than the mounting surface 251 a is formed on the housing 251 . The upper surface of the guide portion 252 is substantially parallel to the mounting surface 251a. In addition, a flat surface 252 a as an example of a second rotation guide mechanism is formed on the guide portion 252 . The plane 252a is substa...

no. 3 example

[0142] Figure 5 It is a schematic diagram showing the main part of the optical pickup device according to the third embodiment of the present invention viewed obliquely from above. in addition, Figure 5 in, with figure 1 , figure 2 The same structural part as that of the first embodiment shown is used with figure 1 , figure 2 The same reference symbols are used for the structural parts, and descriptions thereof are omitted.

[0143] The optical pickup device includes a semiconductor laser device 100 and a housing 351 having a mounting surface 351 a on which the semiconductor laser device 100 is mounted.

[0144] A guide portion 352 having an upper surface higher than the mounting surface 351 a is formed on the housing 351 . The upper surface of the guide portion 352 is substantially parallel to the mounting surface 351a. In addition, two substantially right-angled portions 352 a as an example of second corner portions are formed on the guide portion 352 . In addi...

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Abstract

The present invention relates to a semiconductor laser device and an optical pickup device having the same. The semiconductor laser device (100) comprises a thin metal plate (101) having a support surface (101a), and a LD chip (102) having a front end face (102a) jetting out laser. A round angle part (101b) is formed on the thin metal plate (101) and can allow the thin metal plate (101) to center on the vicinity of a luminous point (P1) of the LD chip (102) and to rotate along a plane parallel to the support surface (101a). Therefore, harmful effect waves and the record regeneration characteristic of CD information can be prevented.

Description

technical field [0001] The present invention relates to a semiconductor laser device on which a semiconductor laser element is mounted on a metal plate, and to carrying out at least one of information reproduction, erasure and recording on optical disks such as CD (Compact Disk) and DVD (Digital Versatile Disk) by mounting the semiconductor laser device. An optical pick-up device. Background technique [0002] The optical pickup device has a laser diode chip as a light source, and records information on an optical disc, reproduces information recorded on the optical disc, or erases information recorded on the optical disc. [0003] Figure 28 A schematic diagram showing the basic structure of a conventional optical pickup device. [0004] The above optical pickup device has a semiconductor laser device 1700 , a collimator lens 1761 and an objective lens 1762 . [0005] According to the optical pickup device configured as described above, the laser light emitted from the se...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): H01S5/00H01L23/48H01L31/12G11B7/125
CPCH01L2924/0002G11B7/127H01L2924/00
Inventor 片山宽
Owner SHARP KK