Semiconductor device, circuit and display device using said device and its driving method

A semiconductor and circuit technology, applied in the driving field of semiconductor devices, can solve problems such as steep threshold changes between circuits, unfixable output, and readout errors
CN1750074AActive Publication Date: 2006-03-22GOLD CHARM LTD

Patent Information

Authority / Receiving Office
CN · China
Current Assignee / Owner
GOLD CHARM LTD
Publication Date
2006-03-22

Smart Images

  • Figure 1
    Figure 1
  • Figure 2
    Figure 2
  • Figure 3
    Figure 3
Patent Text Reader

Abstract

A device excellent in electrical characteristics is provided by suppressing an operation failure owing to a hysteresis effect that occurs in a circuit using MOS transistors having floating bodies. Moreover, sensitivity of a sense amplifier circuit and a latch circuit including these MOS transistors as components is improved. A signal required in a circuit other than a first circuit is outputted by using electrical characteristics of MOS transistors in a first period (effective period), and in a second period (idle period) excluding the first period, between the gate and source of MOS transistors, a step waveform voltage not less than threshold voltages of these MOS transistors is given.
Need to check novelty before this filing date? Find Prior Art

Description

technical field

[0001] The present invention relates to a semiconductor device, a circuit and a display device using the semiconductor device, and a driving method of the semiconductor device, more particularly, to a MOS (metal oxide semiconductor) transistors such as polysilicon TFTs (thin film transistors), circuits and display devices using the semiconductor devices, and driving methods of the semiconductor devices. Background technique

[0002] Polysilicon TFTs formed on insulating substrates once required expensive quartz substrates for high-temperature processing, and have been applied to small-sized, high-value-added display panels. Afterwards, a technique was developed in which a precursor film was formed by methods such as low-pressure (LP) CVD, plasma (P) CVD, or sputtering, and then laser annealed to polycrystallize it, which is capable of allowing the use of A technology that forms polysilicon TFTs at relatively low temperatures on glass substrates, etc. At the...

Claims

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to View More