Photosensitive composition and process for production of printed wiring boards with the same

Abstract

The invention relates to a photosensitive resin composition characterized by containing at least one resin which has photopolymerizable ethylenically unsaturated groups on the side chains and a photosensitive compound which has three or more ethylenically unsaturated groups and exhibits a viscosity of 2000mPa s or above at 25 DEG C under one atm; and a process for the production of wiring boards with the same.

Description

technical field [0001] The present invention relates to a photosensitive resin composition and a method for producing a printed circuit board using the same. Background technique [0002] In order to easily and reliably manufacture printed circuit boards with fine and high-density conductor patterns, a photosensitive resist solution that essentially has excellent resolution and other properties is directly coated on the metal conductor layer on the surface of the insulating substrate to form A dip method is widely known in which a resist layer is etched and the etching resist layer is formed in accordance with a predetermined resist pattern. This method is simple and does not generate pinholes in the formed etching resist layer, so it is an effective method when a relatively thick film of several micrometers to twenty micrometers is required. [0003] However, the etching resist layer formed from the conventionally used photosensitive resist solution has three or more ethyl...

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Problems solved by technology

[0003] However, the etching resist layer formed from the conventionally used photosensitive resist liquid has three or more ethylenically unsaturated groups and has a viscosity of 25° C. at 1 atmosphere. In the case of a photosensitive compound of 2000mPa·s or more, alth