Novel plate fuse and manufacturing method
A fuse and chip technology, applied in emergency protection devices, electrical components, circuits, etc., can solve problems such as poor solvent resistance, and achieve the effects of improving mechanical properties, increasing rated voltage, and enhancing thermal vibration.
- Summary
- Abstract
- Description
- Claims
- Application Information
AI Technical Summary
Problems solved by technology
Method used
Image
Examples
Embodiment Construction
[0021] figure 1 It is a schematic diagram of the appearance of the monolithic surface mount fuse of the present invention, which is manufactured according to the above method, and the proportions of each part are not strictly referred to the actual object, but are enlarged for the convenience of illustration. The fuse 10 includes a surface substrate 20 , a bottom substrate 26 and intermediate layers 22 , 24 . In practical applications, the intermediate layers are not limited to two layers. The layers 20-26 are bonded together to form a monolithic structure.
[0022] like figure 2 As shown in the sectional view formed along the 2-2 line, the ends 30 and 32 of the fuse have three layers, the inner layer 34 is a layer of silver alloy, the middle layer 36 is covered with a layer of nickel, and the outer layer 38 is a lead-tin alloy; 30, 32 and the inner metal film of fuse 10 are conducted.
[0023] image 3 is the cross-sectional view formed along line 3-3 and Figure 4 It i...
PUM
Abstract
Description
Claims
Application Information
- R&D Engineer
- R&D Manager
- IP Professional
- Industry Leading Data Capabilities
- Powerful AI technology
- Patent DNA Extraction
Browse by: Latest US Patents, China's latest patents, Technical Efficacy Thesaurus, Application Domain, Technology Topic, Popular Technical Reports.
© 2024 PatSnap. All rights reserved.Legal|Privacy policy|Modern Slavery Act Transparency Statement|Sitemap|About US| Contact US: help@patsnap.com