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Novel plate fuse and manufacturing method

A fuse and chip technology, applied in emergency protection devices, electrical components, circuits, etc., can solve problems such as poor solvent resistance, and achieve the effects of improving mechanical properties, increasing rated voltage, and enhancing thermal vibration.

Active Publication Date: 2006-07-26
SHANGHAI CHANGYUAN WAYON CIRCUIT PROTECTION CO LTD
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  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

U.S. Patent No. 5,296,833 illustrates a method of manufacturing such a surface mount fuse, coating a metal film on an insulating layer, then covering an insulating layer on top, and finally covering another composition on the upper and lower insulating layers In this way, a thin film fuse with good mechanical properties is obtained; the base material of some traditional surface mount fuses is made of polymer materials, and FR-4 epoxy board is used as the substrate in US Patent No.5,790,008 , copper is the electrode, after a series of processes such as copper cladding, etching, UV curing, laser resistance adjustment, etc., the resistance value of the fuse obtained in this way is very consistent, but due to the limitations of the polymer material itself, its solvent resistance is very poor. Difference

Method used

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  • Novel plate fuse and manufacturing method

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Embodiment Construction

[0021] figure 1 It is a schematic diagram of the appearance of the monolithic surface mount fuse of the present invention, which is manufactured according to the above method, and the proportions of each part are not strictly referred to the actual object, but are enlarged for the convenience of illustration. The fuse 10 includes a surface substrate 20 , a bottom substrate 26 and intermediate layers 22 , 24 . In practical applications, the intermediate layers are not limited to two layers. The layers 20-26 are bonded together to form a monolithic structure.

[0022] like figure 2 As shown in the sectional view formed along the 2-2 line, the ends 30 and 32 of the fuse have three layers, the inner layer 34 is a layer of silver alloy, the middle layer 36 is covered with a layer of nickel, and the outer layer 38 is a lead-tin alloy; 30, 32 and the inner metal film of fuse 10 are conducted.

[0023] image 3 is the cross-sectional view formed along line 3-3 and Figure 4 It i...

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Abstract

This invention relates to new type of safe fuse and its process method, which forms Monolithic structure by more than three layers of glass to ceramics layer and the metal film on each layer with two end prove on the conductive layer with inner metal film conducted. The method to process the fuse comprises the following steps: covering one layer of metal film on glass to ceramics layer; then covering one layer of ceramics layer and repeating the above steps to get the designed layer number to get the crude film slice of the monolithic structure; then cutting the film slice into single fuse to burst into ceramics and finally sealing and coating.

Description

Technical field [0001] The invention relates to a novel chip fuse and a manufacturing method thereof, relating to a ceramic chip fuse used in the field of circuit protection and a method for manufacturing the chip fuse. Background technique [0002] Surface mount fuses are widely used in the field of overcurrent protection, such as circuit boards that require high component miniaturization and integration. Compared to leaded fuses, surface mount types have smaller solder feet and take up less space. U.S. Patent No. 5,296,833 illustrates a method of manufacturing such a surface mount fuse, coating a metal film on an insulating layer, then covering an insulating layer on top, and finally covering another composition on the upper and lower insulating layers In this way, a thin film fuse with good mechanical properties is obtained; the base material of some traditional surface mount fuses is made of polymer materials, and FR-4 epoxy board is used as the substrate in US Patent N...

Claims

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Application Information

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IPC IPC(8): H01H85/06H01H85/08
Inventor 苗明清周欣山钱朝勇余勤民沈十林
Owner SHANGHAI CHANGYUAN WAYON CIRCUIT PROTECTION CO LTD
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