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Light-sensitive resin composite

A technology of photosensitive resin and composition, which is applied in the field of photosensitive resin composition, can solve the problems of high heat resistance and damage of the interlayer insulating film, achieve high heat resistance, ensure reliability, and prevent damage Effect

Active Publication Date: 2010-09-22
DONGJIN SEMICHEM CO LTD
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

However, when using the above-mentioned acrylic resin, it is difficult to exert the high heat resistance required by the interlayer insulating film, so that the insulating film has problems in terms of reflectivity, adhesion, etc., and damage to photographic (photo) equipment due to outgassing

Method used

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Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0071] (manufacture of acrylic copolymer)

[0072] 10 parts by weight of 2,2'-azobis(2,4-dimethylvaleronitrile), 200 parts by weight of propylene glycol monomethyl ether acetate, 30 parts by weight of methacrylic acid, 30 parts by weight of Glycidyl methacrylate, the 4-hydroxyphenyl maleimide of 10 weight parts following formula (1a) and the styrene of 30 weight parts add in the flask that has cooling tube and stirrer, carry out nitrogen displacement Then, stir slowly. The temperature of the reaction solution was raised to 62° C., and the temperature was maintained for 5 hours to produce a polymer solution containing an acrylic copolymer.

[0073] The solid content concentration of the polymer solution containing the above-mentioned acrylic copolymer was 45% by weight, and the weight average molecular weight of the polymer was 8,500. In this case, the weight average molecular weight is the average molecular weight in terms of polystyrene measured using GPC.

[0074] (Manufa...

Embodiment 2

[0081] When producing the acrylic copolymer in the above-mentioned Example 1, use 20 parts by weight of 4-hydroxyphenylmaleimide of formula (1a), and use 20 parts by weight of styrene to produce a solid content of 45% by weight. , The weight average molecular weight is 8400 acrylic copolymers, and the photosensitive resin composition was manufactured by the method similar to the said Example 1.

Embodiment 3

[0083] In the manufacture of the acrylic copolymer of the above-mentioned embodiment 1, use 35 parts by weight of methacrylic acid, use 30 parts by weight of 4-hydroxyphenylmaleimide of formula (1a), use 5 parts by weight of benzene A photosensitive resin composition was produced in the same manner as in Example 1 above except that ethylene was used to produce an acrylic copolymer having a solid content concentration of 45% by weight and a weight average molecular weight of 8,800.

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Abstract

The present invention provides a photosensitive resin composition which is excellent in performances, such as transmissivity, insulation, flatness, and chemical resistance, and also made suitable to use as an interlayer insulation film in a LCD manufacturing process securing the reliability in the following processes by minimizing the gas leakage especially through the high heat resistant interlayer insulation films. The photosensitive resin composition by this invention contains, (a) (i) a phenyl maleimide system compound, (ii) unsaturated carboxylic acid, unsaturated carboxylic anhydride, or their mixture, and (iii) acrylic copolymerization obtained by copolymerizing an epoxy group containing unsaturated compound, (b)1, 2-quinonediazido compounds, and (c) a solvent.

Description

technical field [0001] The present invention relates to a photosensitive resin composition. More specifically, the present invention relates to the following photosensitive resin composition. Specifically, the composition minimizes outgassing in the interlayer insulating film due to its high heat resistance, thereby ensuring reliability in subsequent processes, and is suitable for use as an interlayer insulating film in the LCD manufacturing process. Background technique [0002] In a TFT liquid crystal display element and an integrated circuit element, an interlayer insulating film is used to insulate wiring arranged between layers. [0003] When forming such an interlayer insulating film, the photosensitive material used has excellent smoothness, and the number of steps for obtaining an interlayer insulating film having a required pattern shape is small. [0004] In addition, as the display quality of liquid crystal displays (LCDs) improves, the structure of TFT-type liqu...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): G03F7/012G03F7/008G02F1/133
CPCE04F21/161
Inventor 尹赫敏金柄郁崔相角丘冀赫尹柱豹金东敏吕泰勳郑义澈金东明李浩真
Owner DONGJIN SEMICHEM CO LTD