Method for manufacturing circuit device
A manufacturing method and circuit device technology, applied in the direction of printed circuit manufacturing, circuit, printed circuit, etc., to achieve the effects of reducing surface tension, suppressing shrinkage, and suppressing solder shrinkage
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no. 1 example
[0054] In this example, refer to figure 1 The structure of the hybrid integrated circuit device 10 which is a circuit device of the present invention will be described. figure 1 (A) is a perspective view of the hybrid integrated circuit device 10, figure 1 (B) is its cross-sectional view, figure 1 (C) is a cross-sectional view showing the hybrid integrated circuit device 10 formed with multilayer conductive patterns.
[0055] refer to figure 1 (A) and figure 1 (B), in the hybrid integrated circuit device 10 , the conductive pattern 18 is formed on the surface of the substrate 16 , and circuit elements such as transistors are fixed to the conductive pattern 18 by solder 19 . Furthermore, at least the surface of the substrate 16 is covered with the sealing resin 12 .
[0056] The substrate 16 is a substrate made of metal such as aluminum or copper, or a metal substrate mainly composed of copper or the like, a substrate made of a resin material such as epoxy resin, or ...
no. 2 example
[0065] In this example, refer to Figure 2 to Figure 7 A method of manufacturing the hybrid integrated circuit device 10 described above will be described.
[0066] The first process: refer to figure 2
[0067] In this step, the conductive pattern 18 is formed on the surface of the substrate 16 . figure 2 (A) is a plan view of the substrate 16 in this process, figure 2 (B) is its cross-sectional view.
[0068] refer to figure 2 (A) and figure 2 (B), by patterning the conductive foil pasted on the surface of the substrate 16, the conductive pattern 18 having a predetermined pattern shape is formed. Here, pads 18A, 18B, and 18C are formed by the conductive pattern 18 . The pad 18A (first pad) is a pad to which a heat sink is fixed in a later process, and is formed large. For example, the land 18A is formed in a rectangle of 9 mm×9 mm or more. The pad 18B (second pad) is a pad to which a small-signal transistor or a chip component is fixed, and is formed smaller tha...
no. 3 example
[0112] In this embodiment, another manufacturing method for manufacturing a hybrid integrated circuit device will be described. Here, the circuit components fixed by the solder paste are melted together.
[0113] refer to Figure 8 (A) First, the substrate 16 having the conductive pattern 18 formed on the surface is prepared, and the solder paste 21 is applied to desired pads. In this embodiment, the conductive pattern 18 is used to form the pad 18A and the pad 18B. The pad 18A is a pad to which a heat sink is fixed, and is formed as a large pad of, for example, approximately 9 mm×9 mm or larger. The pad 18B is a pad to which chip components such as chip resistors and small-signal transistors are fixed, and is formed smaller than the pad 18A.
[0114] The solder paste 21 used in this step is the same as the second embodiment, and a flux mixed with sulfur is used. The mixing amount of sulfur is within the range of 20PPM to 80PPM relative to the flux. The addition of sulfur...
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Abstract
Description
Claims
Application Information
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