Structure for mounting semiconductor and method of manufacturing mounting substrate used therein

Abstract

There is provided a structure for mounting a semiconductor part having improved productivity, in which a bump is detached from a land portion and a method of manufacturing a mounting substrate used therein. The structure for mounting the semiconductor part includes a mounting substrate having an insulating substrate on which a wiring pattern and a land portion are provided, a semiconductor part mounted on the mounting substrate using a bump and the land portion, and an underfill inserted between the semiconductor part and the insulating substrate. An undercut portion having an inverse tapered shape from the insulating substrate to an upper surface of the land portion is provided in an edge a of the land portion in which the bump is located, and the bump is inserted into the undercut portion. Accordingly, since the couple between the bump and the land portion becomes stronger, the bump is not detached from the land portion when the underfill expands or contracts.

Description

technical field [0001] The present invention relates to a mounting structure of a semiconductor device suitable for various electronic devices or electronic circuit elements, and a method of manufacturing a mounting substrate used therefor. Background technique [0002] If the drawing of the mounting structure of the existing semiconductor device is described, then Figure 15 It is an enlarged cross-sectional view of the main part of the mounting structure of the existing semiconductor device; Figure 16 It is a plan view of a main part of a mounting substrate showing a structure of a land portion related to a mounting structure of a conventional semiconductor device. [0003] Next, based on Figure 15 , Figure 16 The configuration of a mounting structure of a conventional semiconductor device will be described. The mounting substrate 51 is formed of an insulating substrate 52 , a wiring pattern 53 provided on the insulating substrate 52 , and a land portion 54 provided a...

AI Technical Summary

Problems solved by technology

[0010] Since the conventional manufacturing method of the mounting substrate 51 forms the wiring pattern 53 and the land portion 54 by etching the metal film provided on the insulating substrate 52, the end surface of the island-shaped portion 54a of the land portion 54 becomes vertical. Therefore, there is a problem that, when the underfill 58 expands and contracts in the state where the bump 57 is attached to the land portion 54, the gap between the bump 57 and the land portion 54 will be caused. The attachment produces the problem of detachment

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