114results about "Insulating resist/coating" patented technology

Processes for planarizing a substrate, for encapsulating a printed electronic feature and for forming a ramp feature. In various embodiments, the processes include the steps of: (a) applying a planarizing agent, an encapsulating agent or a ramping feature to a substrate or to an electronic feature disposed thereon, preferably through a direct write printing process, e.g., ink-jet printing, and (b) treating the applied agent under conditions effective to form a planarizing feature, an encapsulation layer or a ramping feature.

A printed wiring board has a large number of wirings formed substantially parallel to one another, a dummy pattern is formed along the wirings and a solder resist layer is formed by coating the wirings and the dummy pattern with a solder resist. The coating thickness of said solder resist gradually decreases toward the edge, wherein the dummy pattern has a solder resist coating thickness control area. A semiconductor device includes the above-mentioned printed wiring board with an electronic part mounted thereon. Accordingly, a slope uniformly extending over the whole width of the solder resist layer is formed at the edge portion of the solder resist layer to improve electrical connectivity.

A printed circuit board and a method of manufacturing the printed circuit board are disclosed. A printed circuit board, which includes an insulation layer, a circuit pattern formed on a surface of the insulation layer that includes at least one pad, and a solder resist which covers the circuit pattern, and in which an opening is formed that exposes a portion of a side and a surface of the pad, can ensure a sufficient amount of attachment area for the pads and the solder resist, to strengthen the adhesion of the pads. Also, the adhesion can be increased between the electronic components and the printed circuit board, and heat release characteristics can be improved.

An assembly is obtained; it includes a substrate; a plurality of wet-able pads formed on a surface of the substrate; and a solder resist layer deposited on the surface of the substrate and having an outer surface. At least the solder resist layer is formed with recessed regions defining volumes adjacent the wet-able pads. Molten solder is directly injected into the volumes adjacent the wet-able pads, such that the volumes adjacent the wet-able pads are filled with solder. The solder is allowed to solidify. It forms a plurality of solder structures adhered to the wet-able pads. The substrate and the solder are re-heated after the solidification, to re-flow the solder into generally spherical balls extending above the outer surface of the solder resist layer. The volumes adjacent the wet-able pads are configured and dimensioned to receive sufficient solder in the injecting step such that the generally spherical balls extend above the outer surface of the solder resist layer as a result of the re-heating step. In an alternative approach, solder injection and solidification are carried out in a nitrogen environment or a forming gas environment, and the reflow step may be omitted.

A circuit board surface structure includes a circuit board having at least one surface provided with a plurality of electrically connecting pads, an insulating protective layer characterized by photosensitivity and solder resisting and formed on the circuit board, and a plurality of openings formed in the insulating protective layer to expose the electrical connecting pads on the circuit board and tapered upward; and a conductive element formed in the opening, so as to increase the contact area and reinforce bonding between the electrically connecting pads and the conductive element.

A card edge connector comprises a connector body and a conductive pad, and is constructed such that the conductive pad terminates at a predetermined distance from the end of the tip portion of the connector body, and that there is further provided a protective pad, adjacent to the terminating portion of the conductive pad, which is formed at the same time with the formation of a wiring pattern in a post-fabrication step of the wiring pattern. Using the card edge connector, an electric card and an electric equipment are also provided.

A circuit board surface structure and a fabrication method thereof are proposed. The circuit board surface structure includes: a circuit board having a plurality of electrically connecting pads formed on at least one surface thereof; a first and a second insulating protective layers formed on the surface of the circuit board in sequence; first and a second openings respectively formed in the first and second insulating protective layers to expose the electrically connecting pads on the surface of the circuit board, wherein the first and second openings have narrow top and wide bottom and the diameter of the first openings is bigger than that of the second openings; and conductive elements formed in the first and second openings on surfaces of the electrically connecting pads. The present structure facilitates to strengthen the bonding between the conductive elements and the corresponding electrically connecting pads.

A printed circuit board is disclosed that is able to prevent outflow of a potting resin out of a sealing region. The printed circuit board includes a conductive pattern formed on an insulating substrate, an electrode for connecting an electronic part to the conductive pattern, and a stripe-like resin-outflow-prevention dam arranged in a periphery of a resin-sealing region covering the electronic part. An outer side surface and an upper surface of the resin-outflow-prevention dam subtend an acute angle.

In a flat display panel having a panel and a flexible board connected and fixed to each other through an anisotropic conductive film, a surface end of a solder resist formed on the flexible board is located to face a surface end of an insulating film layer formed on the panel. Conductive particles contained in the anisotropic conductive film flowing out during a compression bonding process aggregate in a non-connection region due to the thickness of the insulating resin layer. This makes it possible to substantially completely prevent the short-circuit problem due to the aggregation of the conductive particles.

A circuit board and method of manufacturing a circuit board. The circuit board includes a substrate, a conductor layer formed on the substrate, and an insulation layer formed on the substrate and the conductor layer, the insulating layer having an opening with an undercut therein, the opening reaching the conductor layer. A metal layer is formed in the opening of the insulation layer and connected to the conductor layer, a solder layer formed in the opening of the insulation layer and outside of the opening; and an alloy layer formed in a boundary region between the metal layer and the solder layer in the opening. The alloy layer includes a metal of the metal layer and a composition of the solder layer, the alloy layer being more fragile than the metal layer and being formed in a position misaligned from an edge of the undercut of the opening formed on the insulation layer.

To provide a junction structure and a junction method for conductive projection advantageous in that a required reinforcement strength can be obtained while suppressing the amount of a reinforcing resin material supplied to prevent warpage due to curing shrinkage. A conductive projection is joined to the surface of a conductor portion formed at the same level as that of the surface of the insulating layer so that a root portion of the projection is surrounded by a fillet-form resin material. The resin material contains an activator which assists in the junction between the conductive projection and the conductor portion when the resin material is in an uncured state, and is fused by heating to wet and rise the root portion of the conductive projection so as to be in a fillet form. The resin material is cured by an ultraviolet light while excluding the resin material on the conductor portion.

A photoresist pattern is formed on an insulating substrate so that it has a reverse tapered cross section and a reverse pattern of a wiring pattern to be formed. Next, a nanoparticles-containing ink is injected on a wiring region using an inkjet system, followed by a leveling process, a drying process, a resist separation process and a baking process. Thus a wiring pattern is formed.

A wiring board includes a main surface where an electronic component is mounted in a face-down manner so that a surface of the electronic component having plurality of external connecting terminals faces the main surface of the wiring board, the electronic component being fixed to the wiring board by an adhesive; an insulating layer formed on the main surface where the electronic component is mounted; an opening part formed in the insulating layer so that a plurality of adjacent wiring patterns are commonly and partially opened, the adjacent wiring patterns having electrodes where electrodes of the electronic component are connected; wherein an outer periphery of the opening part situated at a center side of the wiring board is formed in an oblique direction against extending directions of the wiring patters.

The present invention provides a circuit carrier for connecting to at least a bump. The circuit carrier comprises a substrate, at least a contact pad on a surface of the substrate and a solder mask layer covering the substrate. The solder mask has at least a stepped opening that exposes a portion of the contact pad. The stepped opening includes at least a first opening and a second opening and the size of the first opening is larger than that of the second opening. The stepped opening of the solder mask layer can contain more pre-solder paste, thus increasing the bonding strength between the bump and the contact pad.

A PCB assembly includes a base, a conductive pattern disposed on the base, a pad provided on a portion of the conductive pattern, a mounting unit disposed on the pad for electrically connecting the conductive pattern and a coverlay having an opening that exposes the mounting unit

A wiring substrate includes: a connection pad having a first surface; a protective insulation layer formed on the first surface of the connection pad and having an opening portion therein, wherein a portion of the first surface of the connection pad is exposed from the opening portion; a metal layer having a lower surface facing the first surface of the connection pad and an upper surface opposite to the lower surface and formed on the first surface of the connection pad which is exposed from the opening portion, the metal layer including a raised portion that extends upward from the upper surface of the metal layer in a peripheral portion thereof; and a bump electrode formed on the upper surface of the metal layer.

A through-hole electrode substrate includes a substrate including a through-hole extending from a first aperture of a first surface to a second aperture of a second surface, an area of the second aperture being larger than that of the first aperture, the through-hole having a minimum aperture part between the first aperture and the second aperture, wherein an area of the minimum aperture part in a planer view is smallest among a plurality of areas of the through-hole in a planer view, a filler arranged within the through-hole, and at least one gas discharge member contacting the filler exposed to one of the first surface and the second surface.

A filet F is added to a portion constituting a corner portion C equal to or smaller than 90° in a crossing portion X of wiring patterns 58b, 58c and 58d, and a wiring pattern 58 is formed. Since the filet F is added, the wiring patterns are not made thin and are not disconnected in the crossing portion X. Further, since there is no stress concentrated to the crossing portion X, disconnection is not caused in the wiring patterns and no air bubbles are left between the crossing portion X of the wiring patterns and an interlayer resin insulating layer so that reliability of a printed wiring board is improved.

Disclosed is a printed circuit board, including a base member, an insulating layer formed on each of both surfaces of the base member so that the surfaces of the base member are flattened, a circuit layer formed on the insulating layer, and a via for connecting the circuit layer formed on one surface of the base member with the circuit layer formed on the other surface of the base member. A method of manufacturing the printed circuit board is also provided.

The invention discloses a fabrication method of a circuit board solder mask layer, and relates to the technical field of producing and manufacturing of circuit boards. The fabrication method of the circuit board solder mask layer sequentially comprises the following steps: covering the surface of the circuit board with solder resist ink and pre-baking and curing the solder resist ink; coating the cured solder resist ink on the surface of the circuit board with a film for carrying out first exposure; enabling the circuit board which is exposed once to pass through a spray developer line, and rinsing out the solder resist ink in the unexposed region with a photograph potion; drying the developed circuit board, and then coating with the film which is the same as that in the first exposure for carrying out second exposure; enabling the circuit board which is exposed for the second time to pass through the spray developer line, and rinsing out the solder resist ink in the unexposed region with the photograph potion. According to the method, the binding force of the solder resist ink and the surface of the circuit board can be reinforced; the problems of bridge drop and bridge cutoff of the solder resist ink are overcome; and the capability of the manufacture procedure of a solder mask bridge site is improved.