Manufacturing method of printed wiring board as well as copper-clad laminate
A technology for a printed circuit board and a manufacturing method, which is applied in the manufacturing of printed circuits, printed circuits, multilayer circuits, etc., can solve problems such as difficulty in miniaturizing wiring design, and achieve the effect of improving the shape of perforations and the accuracy of wiring dimensions.
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Embodiment 1
[0035] image 3 It is a schematic diagram showing the manufacturing process of the printed wiring board of the present invention. image 3 (a)~ image 3 (d) represents the formation process of the inner loop, image 3 (e)~ image 3 (h) shows the formation process of the outer circuit.
[0036] image 3 (a) is a schematic diagram of the inner layer base material 7 . In this example, the copper bonded laminate MCL-E679 manufactured by Hitachi Chemical Co., Ltd. was used as the inner layer substrate, such as image 3 As shown in (b), after forming the inner layer circuit resist pattern on the top of the copper foil, as shown in image 3 As shown in (c), Cu is etched away using a resist as a mask to form an inner layer circuit 2 . Next, if image 3 As shown in (d), a polyimide sheet with copper foil on one side is laminated under pressure on the inner layer substrate 7 on which the inner layer circuit 2 is formed, to form a four-layer copper bonded laminate. The thickness o...
Embodiment 2～3
[0054] In the process of direct piercing processing (refer to figure 2 c) Change the concentration of sodium hydroxide in the alkaline treatment liquid in the range of 10 to 100 g / l, produce a printed wiring board in the same manner as in Example 1, and measure the removal state of molten scattered Cu and protrusions and the etching of the outer layer copper foil. Width, the reduction range of the thickness of the outer layer copper foil and the inner layer wiring was evaluated. The result is as Figure 4 shown. In addition, each alkali treatment condition of Examples 2-3 is shown in Figure 6 middle.
[0055] After the desmutting treatment, the molten spattered Cu and the protrusions were completely removed in each of the examples. The measurement result of the etching width of the outer layer copper foil was 13 to 17 μm. In the evaluation of the decrease in the thickness of the outer layer copper foil, the thickness after the desmear treatment was reduced by 0.6 to 0.8...
Embodiment 4～5
[0057] In the process of direct piercing processing (refer to figure 2 c) Change the temperature of the alkali treatment solution in the range of 30 to 80° C., produce a printed wiring board in the same manner as in Example 1, measure the removal state of molten and scattered Cu and protrusions, and the extent of etching of the outer layer copper foil. Evaluation of the reduction range of layer copper foil and inner layer wiring thickness. The result is as Figure 4 shown. Each alkali treatment condition of embodiment 4~5 is shown in Figure 6 middle.
[0058] After the desmutting treatment, the molten spattered Cu and the protrusions were completely removed in each of the examples. The measurement result of the etching width of the outer layer copper foil was 14 to 18 μm. In the evaluation of the decrease in the thickness of the outer layer copper foil, the thickness after the desmear treatment was reduced by 0.5 to 0.6 μm relative to the thickness after the laser perfo...
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Abstract
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