Alkali developing photosensitive resin composition

A technology of resin composition and developability, applied in optics, photography, opto-mechanical equipment, etc., can solve the problems of insufficient sensitivity of photosensitive resin composition, difficulty in obtaining graphic shapes and fine patterns, etc.

Active Publication Date: 2011-06-22
ADEKA CORP
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

However, the sensitivity of these known alkali-developable photosensitive resin compositions is insufficient, and it is difficult to obtain appropriate pattern shapes and fine patterns.

Method used

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  • Alkali developing photosensitive resin composition
  • Alkali developing photosensitive resin composition
  • Alkali developing photosensitive resin composition

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0094] [Example 1] Production of Alkaline Developable Resin Composition No.1

[0095] Production of 1,1-bis(4'-hydroxyphenyl)-1-(1"-biphenyl)-1-cyclohexylmethane

[0096] 70.5 g of biphenylcyclohexyl ketone, 200.7 g of phenol, and 10.15 g of thioacetic acid were added, and 40.0 g of trifluoromethanesulfonic acid was added dropwise at 18° C. over 20 minutes. After reacting at 17-19° C. for 18 hours, 500 g of water was added to stop the reaction, 500 g of toluene was added, the organic layer was washed with water until its pH reached 3-4, and the organic layer was separated. Toluene, water and excess phenol were distilled off. Toluene was added to the residue, and the precipitated solid was filtered, dispersed and washed with toluene to obtain 59.2 g of pale yellow crystals (51% yield). The melting point of the pale yellow crystals was 239.5° C., and it was confirmed that the pale yellow crystals were the target compound.

[0097] Production of 1,1-bis(4'-glycidoxyphenyl)-1...

Embodiment 2

[0102] [Example 2] Production of Alkaline Developable Resin Composition No.2

[0103] Add 43g1,1-bis(4'-glycidoxy phenyl)-1-(1"-biphenyl)-1-cyclohexylmethane (compound a), 33.6g acrylic acid (compound b-1), 0.04g2,6-di-tert-butyl-p-cresol, 0.21g tetrabutylammonium acetate and 18g propylene glycol-1-monomethyl ether-2-acetate were stirred at 120°C for 13 hours. Cooled to room temperature, Add 24g propylene glycol-1-monomethyl ether-2-acetate and 10g succinic anhydride (compound c-1), and stir for 3 hours at 100°C. Then add 8g bisphenol Z glycidyl ether (compound d-2), After stirring at 120°C for 4 hours, at 90°C for 3 hours, at 60°C for 2 hours, and at 40°C for 5 hours, add 29g of propylene glycol-1-monomethyl ether-2-acetate to obtain propylene glycol- Alkaline developable resin composition No. 2 (Mw=4600, Mn=2100, acid value (solid content) 54 mgKOH / g) of the target product in the form of 1-monomethyl ether-2-acetate solution.

[0104] In addition, the reaction product cont...

Embodiment 3

[0105] [Example 3] Production of Alkaline Developable Resin Composition No.3

[0106]Add 1695g1, 1-bis(4'-epoxypropoxyphenyl)-1-(1"-biphenyl)-1-cyclohexylmethane (compound a), 443g acrylic acid (compound b-1), 6g2 , 6-di-tert-butyl-p-cresol, 11g tetrabutylammonium acetate and 1425g propylene glycol-1-monomethyl ether-2-acetate, stirred at 120°C for 16 hours. Cooled to room temperature, added 931g propylene glycol -1-monomethyl ether-2-acetate, 741 g of hexahydrophthalic anhydride (hereinafter also referred to as compound c-2) and 25 g of tetra-n-butylammonium acetate were stirred at 70° C. for 4 hours. Then add 313g ethylene glycol diglycidyl ether (hereinafter also referred to as compound d-3) and 1463g propylene glycol-1-monomethyl ether-2-acetate, thereby obtain as propylene glycol-1-monomethyl ether-2-ethyl ether Alkali-developable resin composition No. 3 (Mw = 3000, Mn = 1700, acid value (solid content) 43 mgKOH / g) of the target product in the form of an acid acid ester ...

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Abstract

An alkali and negative resin combination, which contains the outcome from making oxygen-linked addition compound many entity anhydrides (C) the multi-functional oxygen-linked compound esterified. The oxygen-linked addition compound, possessing a oxygen-linked radical owned by oxygen-linked resin (A), has the structure shaped by combining oxygen-linked resin expressing with unsaturated unified acid (B) whose structure is shaped by combining at the rate on carboxyl group of 0.1-1.0 and the formula (I) in which the definition of each parameter is seen in the introduction. The esterification is carrying out at the rate of one hydroxyl group in the oxygen -linked addition compound, 0.1-1.0 anhydride structure in the many entity anhydrides (C) and 0.1-1.0 oxygen-linked radical in the multi-functional oxygen-linked compound (D).

Description

technical field [0001] The present invention relates to an alkali-developable resin composition containing a specific compound having an ethylenically unsaturated bond, an alkali-developable photosensitive resin composition containing a photopolymerization initiator in the alkali-developable resin composition, And the manufacturing method of this alkali-developable resin composition. Background technique [0002] The alkali-developable photosensitive resin composition contains the alkali-developable resin composition and photoinitiator which contain the compound which has an ethylenic unsaturated bond. The alkali-developable photosensitive resin composition can be polymerized and cured by irradiating ultraviolet rays or electron rays, so it is used in photocurable inks, photosensitive printing plates, printed circuit wiring boards, and various photoresists. agent etc. Recently, along with the development of thinner, thinner, and higher performance electronic devices, an al...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): G03F7/027G03F7/031G03F7/028
CPCC08F290/14C08G59/14G03F7/027
Inventor 真壁由惠佐藤直美前田直树渊上和幸
Owner ADEKA CORP
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