Method for depositing TiN thin film on base plate of glass
A technology for glass substrates and thin films is applied in the field of depositing TiN thin films on glass substrates, which can solve the problems of cumbersome operation process and achieve the effect of simple process.
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Embodiment 1
[0016] 1) Clean the glass substrate with 10% hydrofluoric acid;
[0017] 2) Put the glass substrate on the graphite support of the reaction chamber of the chemical vapor deposition device, the reaction chamber is evacuated to -0.02Mpa (MPa), and the N 2 Clean the reaction chamber;
[0018] 3) Adjust the distance between the nozzle and the glass substrate to be 5cm;
[0019] 4) Heating the reaction chamber to 600°C;
[0020] 5) TiCl 4 , NH 3 and N 2 The reaction gas is passed into the reaction chamber, where TiCl 4 The flow rate is 300sccm, NH 3 The flow rate is 150sccm, N 2 The flow rate is 900sccm, the pressure of the reaction chamber is -0.02MPa (megapascal), the deposition is carried out at a temperature of 600°C, and the reaction time is 90s. After the reaction is completed, stop feeding the gas and cool it down.
[0021] The resistivity of the prepared TiN film is 1.5×10 4 μΩ.cm, the reflectivity in the infrared region is 45%, and with the increase of wavelength,...
Embodiment 2
[0023] 1) Clean the glass substrate with 10% hydrofluoric acid;
[0024] 2) Put the glass substrate on the graphite support of the reaction chamber of the chemical vapor deposition device, the reaction chamber is evacuated to -0.02Mpa (MPa), and the N 2 Clean the reaction chamber;
[0025] 3) Adjust the distance between the nozzle and the glass substrate to be 25cm;
[0026] 4) Heating the reaction chamber to 600°C;
[0027] 5) TiCl 4 , NH 3 and N 2 The reaction gas is passed into the reaction chamber, where TiCl 4 The flow rate is 300sccm, NH 3 The flow rate is 150sccm, N 2 The flow rate is 900sccm, the pressure of the reaction chamber is -0.02MPa (megapascal), the deposition is carried out at a temperature of 600°C, and the reaction time is 90s. After the reaction is completed, stop feeding the gas and cool it down.
[0028] The prepared TiN thin film is non-conductive and has a reflectivity of 35% in the infrared region, and the emissivity of the thin film tends to ...
Embodiment 3
[0030] 1) Clean the glass substrate with 10% hydrofluoric acid;
[0031] 2) Put the glass substrate on the graphite support of the reaction chamber of the chemical vapor deposition device, the reaction chamber is evacuated to -0.02Mpa (MPa), and the N 2 Clean the reaction chamber;
[0032] 3) Adjust the distance between the nozzle and the glass substrate to be 13cm;
[0033] 4) Heating the reaction chamber to 600°C;
[0034] 5) TiCl 4 , NH 3 and N 2 The reaction gas is passed into the reaction chamber, where TiCl 4 The flow rate is 300sccm, NH 3 The flow rate is 150sccm, N 2 The flow rate is 900sccm, the pressure of the reaction chamber is -0.02MPa (megapascal), the deposition is carried out at a temperature of 600°C, and the reaction time is 90s. After the reaction is completed, stop feeding the gas and cool it down.
[0035] The resistivity of the prepared TiN film is 7.5×10 3 μΩ.cm, the reflectivity in the infrared region can reach more than 50%, and it shows an up...
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