Film-forming apparatus and film-forming method

A film-forming device and a film-forming method technology, applied in the direction of lighting devices, lighting and heating equipment, indirect heat exchangers, etc., can solve the problems of increased cost, waste of raw materials, more waste, etc., to prevent adhesion, prevent waste, The effect of saving raw materials

Inactive Publication Date: 2007-03-28
大见忠弘 +1
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

For example, a single-color organic EL layer is formed on a glass substrate with a size of 400mm×500mm (because it is composed of a hole injection layer, a hole transport layer, a light emitting layer, an electron injection layer, etc., and multi-layer organic film formation is required) about It takes 4 minutes, and it takes about 20 minutes to form 3-color organic EL layers, including transfer and mask exchange, resulting in higher costs
[0011] In addition, in the conventional film forming method, since the vaporized raw material is scattered in no direction, the raw material is also attached to parts other than the substrate, and there is a problem of a lot of waste.
In addition, even if the heating of the evaporating dish is stopped, the vaporization will continue for a short time, resulting in the waste of raw materials during non-film formation.
For example, the problem is exacerbated by the expensive film-forming raw materials of organic EL

Method used

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  • Film-forming apparatus and film-forming method

Examples

Experimental program
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Effect test

Embodiment 2

[0160] It is more preferable to include organic molecules having a molecular weight of several hundred to about 1000 in a heavy base gas such as Xe or Kr and irradiate the substrate, since the gas flow can accurately reach the surface of the substrate. Organic molecules that become solid at around room temperature are adsorbed on the surface of the substrate, and only Xe gas or Kr gas is exhausted to the outside by the exhaust pump. Xe or Kr and common industrial Ar or N 2 In comparison, it is an extremely expensive gas. Preferably, the Xe or Kr recovery circulation system is arranged after the roughing pump.

[0161] Figure 34 shows a system for recovering and recycling Xe gas or Kr gas. In Fig. 34, the turbomolecular pump 77 and the rough pump 78 connected by the cavity 75 and the valve are connected, and the turbo molecular pump 77 and the rough pump 78 receive Ar or N 2 , the Xe gas or Kr gas is recovered by exhausting to the recovery device 79 .

[0162] In order to m...

Embodiment 3

[0167] The lifetime and luminance characteristics of the organic EL element can be improved by removing the organic matter contamination of the organic EL film, but after cleaning, it can be further improved by using a transfer device that does not cause organic matter contamination on the substrate surface when transferring the glass substrate to the film formation device. Its life and brightness characteristics. In conveying such a glass substrate, it is preferable to convey the substrate upward or downward by a clean and dry gas flotation device using porous ceramics as illustrated in FIG. 39 . As exemplified in Example 1, in the case where the substrate surface (deposition surface of the film-forming material) in the film-forming apparatus is facing upward, the substrate surface is upward when the gas is floated and transported, and the substrate surface is facing downward in the film-forming apparatus. In some cases, the substrate face is upward during the gas float trans...

Embodiment 4

[0171] The film forming apparatus in Example 4 of the present invention will be described with reference to FIG. 40 . Fig. 40 is a cross-sectional view of an example of the evaporating device of the present embodiment 4, which is mainly composed of: a decompression container constituting a processing chamber 125 for film formation; The airtight gate valve 124 is connected to the processing chamber 125, and the substrate introduction chamber 123 for entering and exiting the substrate; the substrate introduction door 121 connected to the substrate introduction chamber 123; the substrate support body 132 for fixing the substrate 131 in the decompression container ; the first pump 127 connected to the decompression container and the substrate introduction chamber 123 through the pump gate valve 126; the second pump 130 connected to the exhaust side of the first pump 127; The position between the secondary pumps 130, the pump base gas introduction mechanism 128, 129 that controls t...

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Abstract

For increasing the film-forming rate and enabling uniform film formation and waste elimination of raw material, a film-forming method and a film-forming apparatus can reach an evaporated film-forming material to a surface of a substrate by the flow of a transport gas so as to control the film-forming conditions by the flow of the gas. Thereby a uniform thin film can be deposited on the large-area substrate. That is, by directing the evaporated raw material toward the substrate, it is possible to increase the film-forming rate and achieve uniform film formation.

Description

technical field [0001] The present invention relates to a film forming device and a film forming method for forming a film of a predetermined material layer, and more particularly to a film forming device and a film forming method for forming a film of a predetermined material layer by vaporizing a raw material of a predetermined material. Background technique [0002] A method of forming a film of a predetermined material layer by vaporizing a raw material of a predetermined material is widely used in the manufacturing process of semiconductor devices, flat panel display devices, and other electronic devices. As an example of such an electronic device, an organic EL display device will be described below as an example. An organic EL display device with high luminance and a lifespan of tens of thousands of hours or more uses an organic EL element that is a self-luminous element, and since it can be made thin because there are few peripheral parts such as a backlight, it is a...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): C23C14/24C23C14/12C23C16/448H05B33/10H05B33/28C23C14/54C23C14/56F28F13/08F28F27/02
CPCF28F9/026C23C14/12C23C14/243C23C14/564C23C14/228F28D2021/0077F28F13/08C23C14/541
Inventor 大见忠弘松冈孝明
Owner 大见忠弘
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