53 results about "Roughing pump" patented technology

A semiconductor processing tool includes: a process chamber containing a wafer mount configured to hold a semiconductor wafer; a roughing pump; a pipe connecting the roughing pump to the process chamber; and a hot gas source configured to inject a hot gas into the pipe connecting the roughing pump to the process chamber. A method of semiconductor processing includes rough pumping a process chamber using a roughing pump and, during the rough pumping, injecting a hot gas into a pipe through which the roughing pump performs the rough pumping of the process chamber. After the rough pumping, semiconductor wafer processing is performed using the process chamber. During the semiconductor wafer processing, the process chamber is pumped using a high-vacuum pump backed by the roughing pump.

The utility model discloses a low-energy-consumption vacuum-pumping system of a coating machine, which comprises a coating vacuum chamber, a fine pumping assembly, a pre-pumping assembly and a maintaining pump assembly, the coating vacuum chamber is provided with a vacuum-pumping port and an inflation port, the inflation port is provided with an inflation valve, the fine pumping assembly comprises a first molecular pump, and the pre-pumping assembly comprises a second molecular pump. A high-pressure valve set used for controlling connection and disconnection is connected between the first air inlet end and the vacuumizing opening. A rough pumping valve set is connected between the second air inlet end and the vacuumizing opening, and a preceding-stage valve set is connected between the second air inlet end and the first exhaust end. The maintaining pump assembly comprises a second molecular pump and a maintaining pump body which are sequentially connected in the gas circulation direction, and the third gas inlet end is communicated between the first gas exhaust end and the gas inlet side of the preceding-stage valve set. And the electric energy consumption is greatly saved.