Electroforming thin blade grinding wheel

Abstract

Electroforming thin blade grinding wheel which can be utilized for cutting electronic material components such as QFN, IrDA, LED etc work piece and has advantages that not only preventing burr occurring but also cutting with excellent rectilinear character and high precision, superior abrasion resistance and shell resistance, long service life, and capable of stably keeping high quality of the cut electronic material components. The grinding wheel provided in this invention comprises a thin blade wear particle layer (1) formed by dispersing wear particles in metal coating phase (2). The thin blade wear particle layer (1) has first to fifth wear particle layers (1A-1E) sequentially laminated in layer thickness direction in which wear particle (3) amount of the first, third, fifth wear particle layer (1A,1C,1E) is more than that of the second, fourth wear particle layer (1B,1D).

Description

technical field [0001] In particular, the present invention relates to an electroformed thin-edged grinding wheel suitable for use in cutting after die casting when electronic material parts are manufactured by mounting components and the like together on a substrate, cutting and singulating after die casting. Background technique [0002] For cutting during the production of such electronic material components, electroformed thin grinding wheels comprising an extremely thin abrasive grain layer in which superabrasive grains such as diamond are dispersed in a metal plating phase such as nickel have conventionally been used. However, in recent years, as such an electronic material component, for example, a component called a QFN (quad flat non-leaded package) (quad flat non-leaded package) is obtained by mounting a plurality of components together on a lead frame, Electronic material components that are molded together and then cut into pieces and manufactured, or optical tra...

AI Technical Summary

Problems solved by technology

[0005] However, in such a three-layer electroformed thin-edged grinding wheel composed of a central electroformed abrasive grain layer and outer electroformed abrasive grain layers on both sides described in such Patent Document 1, in the cutting of electronic material components as described above, If the central electroformed abrasive grain layer wears and forms an annular recess, the pair of outer electroformed abrasive grain layers on both sides will cut in first to cut off the metal lead frame and metal electrodes in the molded resin intermittently, so if For example, when cutting, the pair of outer electroformed abrasive grain layers does not contact with the lead frame and the electrode at the same time and cuts in. The resistance and load acting on the two outer electroformed abrasive grain layers become uneven, and the thin-edged grinding wheel may be cut. Vibration occurs in the layer thickness direction of the abrasive grain layer and swings

Also, if the thin-edged grinding wheel swings during cutting in this way, the cutting width of the grinding wheel must be set larger, so the number of electronic material parts that can be manufactured from a limited-sized substrate or the like decreases, and cutting itself may not be possible in some cases.

[0006] In addition, since the annular recess formed by the wear of the central electroformed abrasive layer takes in and removes the chips generated by the electroformed abrasive layers on both outer sides through one recess as described above, there must be a certain degree of difficulty. The width and depth are concave, and the problem that interlayer delamination tends to occur from the boundary between the central electroformed abrasive grain layer and the outer electroformed abrasive grain layer that are thus greatly depressed

Furthermore, since the concentration of the abrasive grains is low, the central electroformed abrasive grain layer that is easily worn is arranged with a large width and depth, so there is a lack of wear resistance as a whole of the electroformed thin-edged grinding wheel, and the life expectancy is relatively short. reach problem

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