Grinding powder material for precision multiline cutting and abrasion

Abstract

The invention discloses a powder cutting and grinding material of precise many-line cutting and grinding manufacturing course, which is composed of two different geometrical shaped powders with one as normal particle powder and the other as column-shaped powder, wherein the grain size is between 3 and 30 um; the rate of length and diameter of column-shaped powder is between 1.5:1 and 10:1; the content of particle-shaped powder is between 5% and 95% and the content of column-shaped powder is between 95% and 5%.

Description

technical field [0001] The invention relates to the technical field of powder cutting abrasives, in particular to a powder cutting abrasives used in the precision multi-wire cutting and grinding processing of materials to play the role of cutting and grinding. technical background [0002] The invention relates to a powder abrasive which is suitable for precise multi-wire cutting and grinding of electronic materials and is added to cutting fluid and used for cutting and grinding. In the process of multi-wire cutting and grinding, cutting fluid or grinding fluid is generally used to mix high-hardness powders such as alumina or silicon carbide (hereinafter referred to as powder) for cutting and grinding (hereinafter collectively referred to as cutting and grinding process). The powder materials used in the process are all of a single nominal particle size and a single gravel shape. In use, it is often impossible to achieve the best results for several key quality points such a...

AI Technical Summary

Problems solved by technology

In the process of multi-wire cutting and grinding, cutting fluid or grinding fluid is generally used to mix high-hardness powders such as alumina or silicon carbide (hereinafter referred to as powder) for cutting and grinding (hereinafter collectively referred to as cutting and grinding process). The powder materials used in the process are all of a single nominal particle size and a single gravel shape. In use, it is often impossible to obtain the best results for several key quality points such as material removal rate, surface quality condition and wafer subsurface damage layer at the same time.

This kind of processing technology using a single powder in the precision grinding process generally has a high cutting speed, the surface will be rough, and the sub-surface damage layer will be deep, which is not conducive to the finishing requirements of the material, especially in the semiconductor wafer industry. Each process has high requirements on the surface quality; at the same time, if the particle size of the gravel is reduced to obtain a better surface quality, the cutting speed generally cannot reach the ideal level, and the efficiency is very low. An increase does not necessarily reduce the