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Encapsulating polyurethane material recipe and encapsulating material containing said recipe

A packaging material, polyurethane technology, applied in chemical instruments and methods, other chemical processes, etc., can solve problems such as poor storage stability, and achieve the effects of improving mechanical properties, convenient use, and easy reaction process.

Active Publication Date: 2007-06-27
靖江德方科技服务有限公司
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0008] The purpose of the present invention is to overcome the shortcoming of the poor storage stability of the polyurethane encapsulation material prepared by the polyurethane encapsulation material formula in the prior art, to provide a kind of polyurethane encapsulation material formula and containing Encapsulating material for this formulation

Method used

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Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0029] This example is used to illustrate the polyurethane encapsulating material formula provided by the present invention and the encapsulating material containing the formula.

[0030] Put 3 kg of polyether Diol-2000 and 2 kg of polyether trihydric alcohol 330N into a reaction kettle equipped with a thermometer, agitator and condensing device with a vacuum dehydration device. Dehydration was carried out under stirring for 2 hours; then the reactor was cooled to 45°C, and then 2.2 kg of carbodiimide-ketoureaimine modified 4,4′-diphenylmethylene diisocyanate was added, and the temperature was slowly raised to 80°C , heat preservation reaction for 3 hours; then put 0.8 kg of N-ethyl-γ-aminoisobutyltrimethoxysilane, continue the reaction until no isocyanate groups can be titrated, and degas until there are no bubbles; then add 1.2 kg of phthalate Dioctyl formate, continue to react for 1 hour, then lower the temperature to 40°C, then add 0.03 kg of 2,2'-dimorpholino ethyl ether,...

Embodiment 2

[0032] This example is used to illustrate the polyurethane encapsulating material formula provided by the present invention and the encapsulating material containing the formula.

[0033] Put 3 kilograms of polyether diol Diol-2000 and 2 kilograms of polyether trihydric alcohol 3050 into the reaction kettle equipped with thermometer, agitator and condensing device with vacuum dehydration device, at a vacuum degree of 0.07 MPa, temperature Stir at 100°C for dehydration for 3 hours; then cool the reactor to 45°C, then add 2.2 kg of liquefied 4,4'-diphenylmethylene diisocyanate obtained by liquefaction with carbodiimide-ketoureaimine , slowly raise the temperature to 85°C, and keep it warm for 3 hours; then put in 0.9 kg of N-ethyl-γ-aminoisobutyltrimethoxysilane, continue the reaction until no isocyanate groups can be titrated, and degas until there are no bubbles; Add 1.2 kg of dibutyl phthalate, continue the reaction for 1 hour, then cool down to 40°C, then add 0.1 kg of triet...

Embodiment 3

[0035] This example is used to illustrate the polyurethane encapsulating material formula provided by the present invention and the encapsulating material containing the formula.

[0036] Put 5 kg of polyether diol Diol-2000 into a reaction kettle with a vacuum dehydration device equipped with a thermometer, a stirrer and a condensation device, and stir for 2 hours at a vacuum of 0.08 MPa and a temperature of 110 ° C. Then the reactor was cooled to 45°C, and then 2 kilograms of liquefied 4,4'-diphenylmethylene diisocyanate obtained by liquefaction with carbodiimide-ketureimine was added, and the temperature was slowly raised to 80°C, and the heat preservation reaction 3 hours; then add 0.2 kg of γ-aminopropyltriethoxysilane and 0.5 kg of N-ethyl-γ-aminoisobutyltrimethoxysilane, continue the reaction until no isocyanate groups can be titrated, and degas to No bubbles; then add 0.9 kg of dioctyl phthalate, continue the reaction for 1 hour, then cool down to 40 °C, then add 0.08 ...

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PUM

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Abstract

The encapsulating polyurethane material consists of polyether polyol and diphenyl methylene diisocyanate, and the diphenyl methylene diisocyanate is liquefied 4, 4'-diphenyl methylene diisocyanate. The encapsulating polyurethane material as one kind of high strength single component wet cured encapsulating polyurethane material has excellent storage stability, short curing period, convenient use, excellent adhesion and no bubble produced during wet curing. It is suitable for sealing and adhering glass, PVC, PP, ABS and other plastics, especially memory card.

Description

technical field [0001] The invention relates to a formula of polyurethane encapsulation material and the encapsulation material containing the formula. Background technique [0002] Polyurethane (PU) adhesives are adhesives containing urethane groups (-NHCOO) and / or isocyanate groups (-NCO) in their molecular chains. Polyurethane adhesives have good adhesion to various substrates because their main resin molecules contain a large number of polar groups and active reactive groups. By adjusting its raw materials and formulations, polyurethane adhesives with different uses and bonding different materials can be designed. So far, it has become a type of adhesive with a wide variety and wide application. [0003] Polyurethane adhesives were first developed in the 1940s and developed rapidly after the 1980s, mainly including polyisocyanate solvent adhesives, thermoplastic polyurethane solvent adhesives, reactive single-component solvent adhesives, reactive two-component solvent a...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): C08L75/08C08K5/5415C09K3/10
Inventor 杨志祥
Owner 靖江德方科技服务有限公司
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