Wafer and cutting method thereof

Abstract

The invention relates to a crystal and relative cutting method, wherein said method comprises that: preparing the first and second base boards; at the back of second base board forming several correcting marks to form two reference coordinate axles; then matching the first and second base boards to obtain crystal; the right face of second base board matches the low face of first board; then cutting the first base board to form several first tool marks; cutting the second base board via two reference coordinate axles to obtain the several second tool marks. The invention uses reference coordinate axles to replace traditional reference coordinate axle. The invention can simplify the process and shorten time.

Description

【Technical field】 [0001] The present invention relates to a wafer and its cutting method, and in particular to a wafer with calibration marks and its cutting method. 【Background technique】 [0002] Please refer to the cross-sectional diagram of a conventional wafer shown in FIG. 1 . The conventional wafer 100 includes a Micro Electro-Mechanical System (Micro Electronic Mechanic System, MEMS) 102 and a Complementary Metal-Oxide Semiconductor (Complementary Metal-Oxide Semiconductor, CMOS) 104 . The MEMS 102 is a glass plate with an upper surface 102a and a lower surface 102b. The CMOS 104 is a silicon plate with a front side 104a and a back side 104b. The bottom surface 102 b of the MEMS 102 is separated from the front surface 104 a of the CMOS 104 by a gap 106 . The colloid 112 is filled in part of the gap 106 to match and combine the MEMS 102 and the CMOS 104 . [0003] The conventional dicing method of the wafer 100 is to first form a plurality of first knife marks 122 ...

AI Technical Summary

Problems solved by technology

[0005] However, since the materials of the MEMS 102 and the CMOS 104 are not the same, when the MEMS 102 and the CMOS 104 are integrally cut to form the first coordinate axis REF1 and the second coordinate axis REF2, many question

For example, if the MEMS 102 and the CMOS 104 are cut with a tool specially used for cutting glass, the CMOS 104 will bend due to the vibration of the tool, causing defects in the wafer 100

If cutting the microelectromechanical system 102 and the complementary metal oxide semiconductor 104, respectively, use a special glass cutting tool and a special silicon cutting tool, because the thickness of different tools is not the same, there will be a distance error when changing the tool, and the crystal The mass of the circle 100 affects

In addition, the process of cutting the first coordinate axis REF1 and the second coordinate axis REF2 is quite time-consuming, and it is easy to cause wear and tear of the tool, which greatly increases the production time and cost of the wafer 100

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