Heat sink including a heat dissipating fin and method for fixing the heat dissipating fin

a technology of heat dissipation fin and heat sink, which is applied in the direction of cooling/ventilation/heating modification, semiconductor/solid-state device details, semiconductor devices, etc., can solve the problems of reducing the strength of the heat dissipation fin, high processing cost, and softening of the fin

Inactive Publication Date: 2002-07-04
FURUKAWA ELECTRIC CO LTD +1
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

However, the above-mentioned conventional method for attaching the elongated folded fin to the heat transfer plate, block or the like has the following problems.
Namely, the method of joining the elongated folded fin to the heat transfer plate, block or the like by brazing or soldering, as well as the method of adhering the heat transfer plate, block or the like by the adhesive agent have a problem of its high processing cost.
Additionally, the method of joining the elongated folded fin to the heat transfer plate, block or the like by brazing or soldering has a problem that the fin is softened arid the strength thereof is lowered by the heat in the joining process.
The method of fixing the

Method used

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  • Heat sink including a heat dissipating fin and method for fixing the heat dissipating fin
  • Heat sink including a heat dissipating fin and method for fixing the heat dissipating fin
  • Heat sink including a heat dissipating fin and method for fixing the heat dissipating fin

Examples

Experimental program
Comparison scheme
Effect test

example 1

[0122] According to the present invention, a heat generating element (of 25 mm in length, 25 mm in width, 2 mm in height, and 15 W in heat generating rate) mounted on a circuit board (of 150 mm in length, 70 mm in width and 1.2 mm in thickness) of an electronic device was cooled by a heat sink including a heat dissipating fin comprising the following.

[0123] More specifically, as the base member in the heat sink, a shielding plate for electromagnetic shield (of 150 mm in length, 70 mm in width, 0.5 mm in thickness) which is made of aluminum A1050 was used.

[0124] As the heat dissipating fin, a folded (corrugated) fin made of aluminum A1050 in which the height of the mountain-shaped portions is 35 mm, the pitch of mountains is 4 mm, the depth is 20 mm, the number of mountains is 8, and the thickness of the fin plate is 0.4 mm was used.

[0125] As the fitting member, a heat receiving and heat transfer block made by an aluminum die casting process (of 90 mm in length, 45 mm in width and 4 ...

example 2

[0133] A heat sink including a heat dissipating fin was prepared by embedding a heat pipe of 3 mm in diameter and 90 mm in length in the fitting member used in the Example 1.

[0134] More specifically, an L-shaped groove of 2.9 mm in width, 2.9 in depth and 90 mm in length was formed in the middle portion of the fitting member, which was positioned 45 mm laterally from one end of the fitting member. The L-shaped groove was formed therein along the longitudinal direction of the heat dissipating fin.

[0135] The other components and a method for fabricating them were the same as those shown in Example 1.

[0136] A wind inside the apparatus was also the same as described in Example 1.

[0137] The heat sink including the above-mentioned heat pipe were operated to dissipate and cool the heat generated by the heat generating element, and the surface temperature of the heat generating element was measured. As a result, a temperature rise from the atmospheric temperature was 43.degree. C. and the h...

example 3

[0138] According to the present invention, a heat generating element (of 25 mm in length, 25 mm in width, 2 mm in height, and 15 W in heat generating rate) mounted on a circuit board (of 150 mm in length, 70 mm in width and 1.2 mm in thickness) of an electronic device was cooled by a heat sink including a heat dissipating fin comprising the following.

[0139] More specifically, as the base member in the heat sink, a shielding plate for electromagnetic shield (of 150 mm in length, 70 mm in width, 0.5 mm in thickness) which is made of aluminum A1050 was used.

[0140] As the heat dissipating fin, a folded (corrugated) fin made of aluminum A1050 in which the height of the mountain-shaped portions is 35 mm, the pitch of mountains is 4 mm, the depth is 20 mm, the number of mountains is 8, and the thickness of the fin plate is 0.4 mm was used.

[0141] As the fitting member, a heat receiving and heat transfer block made by an aluminum die casting process (of 90 mm in length, 45 mm in width and 4 ...

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PUM

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Abstract

A heat sink including a heat dissipating fin comprises (1) a heat dissipating fin having a plurality of mountain-shaped portions and base portions supporting the mountain-shaped portions, (2) a base member having a plurality of slits into which the mountain-shaped portions of the heat dissipating fin are to be inserted and a plurality of holes for fixing the heat dissipating fin, and (3) a fitting member, provided with a plurality of projecting portions corresponding to the plurality of holes of the base member, for fixing the heat dissipating fin between the base member and the fitting member itself.

Description

[0001] This application claims priority under 35 U.S.C. .sctn.120 to co-pending U.S. patent application entitled "HEAT SINK INCLUDING A HEAT DISSIPATING FIN AND MEHTOD FOR FIXING THE HEAT DISSIPATING FIN", having application Ser. No. 09 / 642,742, filed on Aug. 18, 2000.[0002] 1. Field of the Invention[0003] The present invention relates to a heat sink including a heat dissipating fin and a method for fixing the heat dissipating fin to the heat sink main body. A heat sink including a heat dissipating fin according to the present invention may be utilized not only for heat dissipating and cooling of a heat generating electronic component or the like used in an electronic device but also for heat dissipating and cooling of articles in any field which require heat dissipation.[0004] 2. Related Art[0005] A semiconductor chip or the like used in various electronic devices such as a personal computer, a game console, an audio system or the like has been made smaller in size, and larger in i...

Claims

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Application Information

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IPC IPC(8): H01L23/367H01L23/40
CPCH01L23/3672H01L23/4006H01L2023/4056H01L2023/4081H01L2023/4087H01L2924/0002H01L2924/00
Inventor SASAKI, CHIYOSHISOTANI, JUNJIOHMI, MASARUHAMA, TOSHIKATSUOOTORI, YASUHIRO
Owner FURUKAWA ELECTRIC CO LTD
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