Method of manufacturing tape wiring substrate

Abstract

A method of manufacturing a tape wiring substrate, by which the production cost can be reduced by a simplified manufacturing process. A fine wiring pattern having fine pitches can be formed. The method of manufacturing a tape wiring substrate includes preparing a base film, forming a metal layer on the base film, and processing the metal layer into a wiring pattern using a laser. In addition, the metal layer is partially removed using the laser, and a wiring pattern is formed by a subsequent wet etching.

Description

[0001] This application claims priority from Korean Patent Application No. 10-2004-0017943 filed on Mar. 17, 2004 in the Korean Intellectual Property Office, the disclosure of which is incorporated herein in its entirety by reference. BACKGROUND OF THE INVENTION [0002] 1. Field of the Invention [0003] The present invention relates to a method of manufacturing a tape wiring substrate, and more particularly, to a method of manufacturing a tape wiring substrate, by which a wiring pattern is formed using a laser. [0004] 2. Description of the Related Art [0005] According to a recent trend for thin, compact, highly integrated, high speed and multi-pin semiconductor devices, tape wiring substrates have been increasingly employed in techniques of mounting semiconductor chips. The tape wiring substrates are configured so that a wiring pattern layer is formed on a base film made of an insulating material such as polyimide resin. It is possible to apply a tape automated bonding (TAB) technique...

AI Technical Summary

Benefits of technology

The present invention provides a method of manufacturing a tape wiring substrate that reduces production costs and allows for the formation of fine wiring patterns with small pitches. This is achieved by preparing a base film, adding a metal layer, and processing the metal layer into a wiring pattern using laser. Additionally, the method can involve partially removing areas outside of the wiring pattern and etching the remaining area to further improve the wiring pattern.

Problems solved by technology

So many processing steps give rise to an increase in the volume of a production line, and volumes of materials that are consumed regularly, for example, PR, PR developer, copper foil etchant or the like, become increased, thereby inevitably increasing the production cost.

Further, since the light source 132 having a relatively large wavelength of several hundreds of micrometers is used in the conventional photolithographic etching, it is quite difficult to form a micro scale wiring pattern having fine pitches on the copper foil 120.

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