IC card and method of manufacturing the same

a technology of integrated circuits and manufacturing methods, applied in the direction of instruments, semiconductor/solid-state device details, coatings, etc., can solve the problems of severe limitations on the kind of usable resin, impaired coating such as au plating formed on the surface of the electrode in the slot, etc., to achieve less space, high strength, and less water penetration.

Inactive Publication Date: 2006-03-16
RENESAS TECH CORP
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Benefits of technology

"The present invention provides an IC card with high reliability and a manufacturing method thereof. The IC card comprises a semiconductor device sealed with a thermosetting resin material and having an external connection terminal electrically connected to the semiconductor chip. The case is made of a thermoplastic resin material and over which the semiconductor device is to be loaded. The semiconductor device is then sealed with a thermoplastic resin material so as to expose the external connection terminal, thereby integrating the semiconductor device with the case. The invention solves the problem of impairing the coating on the electrode in the slot when inserting or removing the IC card. The method reduces the cost of materials and improves mass productivity. The technical effects of the invention are high reliability, reduced cost, and improved manufacturing efficiency."

Problems solved by technology

According to the investigation by the present inventors, use of a molding resin having such a high modulus of elasticity for the formation of the outer face of the IC card is accompanied with the problem that upon inserting or removing the IC card in or from a slot, a coating such as Au plating formed on the surface of the electrode in the slot is impaired.
When a solder connection for electrically connecting a semiconductor chip to an interconnect over a wiring substrate is exposed from the wiring substrate, it is necessary, upon molding, to select a processing temperature so that the temperature of the solder connection will not exceed the melting point of the solder, which, however, imposes a severe limitation on the kind of a usable resin.

Method used

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  • IC card and method of manufacturing the same
  • IC card and method of manufacturing the same
  • IC card and method of manufacturing the same

Examples

Experimental program
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embodiment 1

[0068] The IC card of this embodiment and its manufacturing steps will next be described with reference to drawings. FIG. 1 is a perspective view illustrating the appearance of an IC card according to this embodiment of the present invention, while FIG. 2 is a cross-sectional view of the IC card of FIG. 1 along a longitudinal direction (line A-A).

[0069] The IC card 1 of this embodiment as illustrated in FIGS. 1 and 2 is a memory card usable mainly as an auxiliary storage unit for various portable electronic devices, for example, information processing units such as mobile computer, image processing units such as digital camera, communications devices such as mobile phone. It is usable while being installed in the electronic devices as described above. IC card 1 is, for example, a small thin plate having a rectangular plane (card shape) and it may have various outside dimensions, for example, having a long side of about 32 mm, a short side of about 24 mm and a thickness of 1.4 mm. I...

embodiment 2

[0101] FIGS. 22 to 24 are cross-sectional views of an IC card according to another embodiment of the present invention during its manufacturing steps. To facilitate the understanding, the inside structure (semiconductor chip 7, bonding wire 9 and interconnect 10) of the IC body 4 is not illustrated in FIGS. 23 and 24.

[0102] In Embodiment 1, the IC card 1 was manufactured by installing the IC body 4 in the case 2 prepared in advance, and forming the case 2 integral with the IC body 4 by molding the sealing portion 3. In this Embodiment, on the other hand, molding of the case 2, installing of the IC body 4 in the case 2, and molding of the sealing portion 3 are carried out by injecting a resin material twice in a mold.

[0103] As illustrated in FIG. 22, a mold (base mold, lower mold) 20 and another mold (upper mold) 21 for the formation of a case are prepared as illustrated in FIG. 22. A cavity 22 having a shape corresponding to the case 2 is formed by the mold 20 and mold 21. A resin...

embodiment 3

[0108] In Embodiment 1, described was the manufacture of the IC card 1 by mounting the semiconductor chip 7 over the wiring substrate 5, carrying out wire bonding, and forming the sealing portion 8 so as to cover the semiconductor chip 7 and the bonding wire 9. In this embodiment, on the other hand, mounting of the semiconductor chip 7 over the wiring substrate 5 by flip chip connection (flip chip bonding) will be described.

[0109]FIG. 25 is a perspective view illustrating the appearance of a semiconductor chip 7a used in this embodiment; and FIG. 26 is its plan (bottom) view. FIG. 27 is a perspective view illustrating the semiconductor chip 7a of FIG. 25 or FIG. 26 mounted over the wiring substrate 5; and FIG. 28 is its bottom view. FIG. 29 is a perspective view illustrating the appearance of the IC body 4a of this embodiment.

[0110] As illustrated in FIGS. 25 and 26, over one of the main surfaces of the semiconductor chip 7a, a plurality of solder bumps (bump electrodes) 31 electr...

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Abstract

An IC body is loaded to a case 2 made of thermosetting resin material and sealed with a sealing portion made of thermosetting resin material to be integrated, whereby an IC card is manufactured. The IC body comprises: a wiring substrate formed with an external connection terminal at a back surface thereof; a semiconductor chip loaded over a surface of the wiring substrate and electrically connected to the external connection terminal via a interconnect; and the sealing portion made of thermosetting resin material so as to cover the semiconductor chip and a bonding wire. The sealing portion is formed so that the external connection terminal is exposed. The present invention makes it possible to heighten the strength of IC cards and at the same time, to reduce the manufacturing cost and improve the reliability.

Description

BACKGROUND OF THE INVENTION [0001] The present invention relates to IC (integrated circuit) cards and manufacturing techniques thereof, for example, a technique effective when adapted to a semiconductor memory card (which will hereinafter be called “memory card”). [0002] A variety of IC cards have been used and semiconductor memory cards (which will hereinafter be called “memory cards”, simply) such as multimedia cards (having standards standardized by Multimedia Card Association) and SD memory cards (having standards standardized by SD Card Association) can be classified as memory devices capable of storing information in semiconductor memory chips inside thereof. When they are used, information is available by accessing directly and electrically to a non-volatile memory of the semiconductor memory chip, and a memory medium can be change easily without controlling the machine system. Thus, they have excellent features. Owing to compact size and light weight, they are used as an aux...

Claims

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Application Information

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Patent Type & AuthorityApplications(United States)
IPC IPC(8): G06K19/06B42D15/10B29C45/14B29C45/16G06K19/07G06K19/077H01L23/498
CPCB29C45/14647B29C45/14655H01L2924/12041H01L2924/10253H01L24/48H05K2203/1572H05K2203/1316H05K2201/10159H05K3/284B29C45/1657B29C45/1671B29C2045/1673H01L21/563H01L21/565H01L23/3121H01L23/3135H01L23/49855H01L24/45H01L2224/45144H01L2224/48091H01L2224/48227H01L2224/48247H01L2924/01014H01L2924/01078H01L2924/01079H01L2924/12044H01L2924/14H05K1/117H01L2924/00014H01L2924/00H01L2924/181H01L2924/00012G06K19/07
InventorOSAKO, JUNICHIRONISHIZAWA, HIROTAKAOSAWA, KENJIHIGUCHI, AKIRA
OwnerRENESAS TECH CORP