Method of manufacturing semiconductor device, semiconductor device, and mounting structure of semiconductor device

Abstract

A method of manufacturing a semiconductor device, including the following steps, forming a resin layer on a surface of a semiconductor chip, the surface is provided with a bump formed thereon, the resin layer having photosensitivity and adhesiveness, exposing an upper surface of the bump by removing a part of the resin layer right above the bump by exposing and then developing the resin layer, and bonding the semiconductor chip provided with a resin film formed of the resin layer face-down to a substrate, the bump of the semiconductor chip and a conductive section of the substrate being electrically connected by the resin film functioning as an adhesive.

Description

RELATED APPLICATIONS [0001] This application claims priority to Japanese Patent Application Nos. 2004-268116 filed Sep. 15, 2004; 2005-088713 filed Mar. 25, 2005; and 2005-210067 filed Jul. 20, 2005 which are hereby expressly incorporated by reference herein in their entirety. BACKGROUND OF THE INVENTION [0002] 1. Technical Field [0003] The present invention relates to a semiconductor device equipped with a semiconductor chip, a method of manufacturing the semiconductor device by a face-down bonding process, and a mounting structure of the semiconductor device. [0004] 2. Related Art [0005] As a mounting method of a semiconductor chip by a face-down bonding process, a method using an anisotropic conductive membrane (See, for example, Japanese Unexamined Patent Publication No. 4-32171.) composed of anisotropic conductive paste (ACP) or an anisotropic conductive film (ACF) and a method using insulation resin for bonding (See, for example, Japanese Unexamined Patent Publication No. 4-82...

AI Technical Summary

Benefits of technology

[0043] According to the mounting structure of the semiconductor device, since the mounting structure is formed by one of the methods of manufacturing the semiconductor device, the mounting cost can be reduced by eliminating any dedicated devices as described above. And further, since the resin can be avoided from

Problems solved by technology

Therefore, the dedicated devices required therefor problematically raise the mounting cost.

Further, in the method in which the resin is provided to the substrate side and the semiconductor chip is bonded thereon by a face-down bonding process, since a bump of the semiconductor chip is connected to a land (a conductive section) on the substrate while pushing through the resin to move aside, the resin (the adhesive) cannot be prevented from remaining between the land and the bump.

And, the land and the bump could be exfoliated from each other because of the difference in the thermal expansion coef

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