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Cooling fin assembly

a technology of cooling fins and components, applied in the field of cooling fins, can solve the problems of computer operation being affected, the heat generation of the cpu is high, and the heat dissipation is the most important issue, so as to reduce the resistance of cooling airflow and increase the cooling efficiency

Inactive Publication Date: 2006-10-12
CHEN CHAO CHUAN
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Benefits of technology

"The present invention provides a cooling fin assembly that reduces resistance to cooling airflow and increases cooling efficiency. The assembly includes a plurality of fins coupled in series and formed in an annular fashion, which allows airflow channels and reduces flow resistance. The fins are distributed radially, allowing airflow in any direction. The assembly also includes a base and a plurality of anchoring elements to securely attach a fan to the fins. The technical effects of the invention include improved cooling efficiency and secure attachment of the fan to the fins."

Problems solved by technology

As it is in an operating condition constantly and processes at a high clock frequency, the CPU generates a lot of heat.
Heat dissipation is the most important issue.
If the CPU cannot be cooled effectively, computer operation could be malfunctioned, and CPU bum out could happen.
Although liquid cooling or heat pipe devices have been developed to enhance heat transfer, the cooling methods that use liquid as a heat transfer medium are difficult to fabricate and install, and leaking of working fluid is still a problem not yet fully resolved.
But the fins, formed by aluminum extrusion have a limited fin pitch and cannot increase heat transfer area as desired.
Arranging the fins rapidly in an annular fashion and mounting on a base still has technical problems in actual implementation.

Method used

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Embodiment Construction

[0021] Referring to FIGS. 2A and 2B, the cooling fin assembly according to the invention comprises a plurality of fins 10 coupled in series and arranged in a desired form, such as a linear fashion or an annular fashion.

[0022] The fins 10 are made of thermal conductive material such as aluminum or copper and formed by punching. Each of the fins 10 has an inner edge 11, an outer edge 12, a top edge 13 and a bottom edge 14. After coupled and arranged in an annular shape. The middle portions of the top edge 13 and bottom edge 14 have respectively a latching element 15 extended vertically towards the same side and is integrally formed on the fin 10 by punching. The latching element 15 has a latching section 151 on the end of the fin 10 that has protrusions 151 a on two edges. There is a latching opening 152 formed on a juncture the latching element 15 and the fin 10 to receive the latch section 151 of another fin 10. The two protrusions 151 a have pointed ends spaced from each other at ...

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Abstract

A cooling fin assembly includes a plurality of fins, each having a latching element on the top edge and the bottom edge, to couple with each other in series, forming an annular arrangement. The fins coupled in the annular fashion are surrounded and confined by a strapping ring. The fins have respectively a bottom plate extended vertically from the fins to be in contact with the top surface of a base, which has a bottom surface in contact with the surface of a heat source, to dissipate heat.

Description

FIELD OF THE INVENTION [0001] The present invention relates to a cooling apparatus for electronic devices and particularly to a cooling fin assembly, which has fins coupled in series and is arranged in an annular fashion. BACKGROUND OF THE INVENTION [0002] As the operation clock frequencies of central processing units (CPUs) become faster, the performance of computers also increases significantly. More electric power is consumed and more heat is generated. The peripheral devices such as hard disk drives, compact disk drives, graphic chips and system core logic chipsets also generate more heat as the performances are enhanced. Hence an enhanced cooling device has to be provided to transfer the heat energy of the computer to the surrounding environment, to prevent the computers from being overheated and malfunctioned. [0003] The CPU is the brain of a computer. As it is in an operating condition constantly and processes at a high clock frequency, the CPU generates a lot of heat. Heat d...

Claims

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Application Information

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Patent Type & Authority Applications(United States)
IPC IPC(8): F28F7/00
CPCF28F3/02H01L23/3672H01L23/467H01L2924/0002H01L2924/00
Inventor CHEN, CHAO-CHUAN
Owner CHEN CHAO CHUAN