Method of producing laser-processed product and adhesive sheet, for laser processing used therefor

a technology of laser processing and laser processing, which is applied in the direction of manufacturing tools, transportation and packaging, chemistry apparatus and processes, etc., can solve the problems of carbon deposits, inability to meet demand, and inability to drill or die conventionally, and achieve the effect of suppressing contamination of the machining surfa

US20060246279A1Inactive Publication Date: 2006-11-02NITTO DENKO CORP
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Patent Information

Authority / Receiving Office
US · United States
Patent Type
Applications(United States)
Current Assignee / Owner
Publication Date
2006-11-02
Estimated Expiration
Not applicable · inactive patent

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Abstract

A manufacturing method of laser processed parts is characterized in that at least a pressure-sensitive adhesive layer is provided on a base material as a pressure-sensitive adhesive sheet (2) for laser processing, using a material having specified physical properties, and this method comprises a step of adhering the pressure-sensitive adhesive sheet (2) for laser processing to the laser beam exit side of the work (1) by way of the pressure-sensitive adhesive layer, a step of processing the work by irradiating the work with a laser beam (6) of within 2 times of the irradiation intensity for forming a through-hole in the work (1), at higher than the irradiation intensity of threshold for inducing ablation of the work (1), and a step of peeling the pressure-sensitive adhesive sheet (2) for laser processing from the work (1) after the machining. Therefore, contamination of the work surface by decomposition products can be effectively suppressed, and laser processed parts can be manufactured easily and at high production efficiency.
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Description

TECHNICAL FIELD

[0001] The present invention relates to a manufacturing method of laser processed parts for machining works such as various sheet materials, circuit boards, semiconductor wafers, glass substrates, ceramic substrates, metal substrates, semiconductor laser or other light emitting or receiving element substrates, MEMS substrates, semiconductor packages, cloth, leather, paper or the like, by using laser, by cutting, drilling, marking, grooving, scribing, trimming, or other shaping process, and an pressure-sensitive adhesive sheet for laser processing used for this purpose. BACKGROUND ART

[0002] As the electronic and electric appliances are reduced in size recently, component parts are also reduced in size and advanced in definition, and high definition and high precision are demanded in machining of parts at machining precision of + / −50 μm or less. In the conventional press processing or blanking process, the precision is about + / −100 μm at most, and such demand cannot b...

Examples

first exemplary embodiment

[Pressure-Sensitive Adhesive Sheet]

[0100] First of all, the pressure-sensitive adhesive sheet used in the first exemplary embodiment of the invention is explained. In the exemplary embodiment, the pressure-sensitive adhesive sheet is used when processing the work by ablation using laser beam of wavelength in ultraviolet region or laser beam capable of absorbing the light in ultraviolet region passing through multiple photon absorbing process. It is composed of at least a base material and a pressure-sensitive adhesive layer disposed thereon (the detail of the base material and adhesive layer is described later). More specifically, the pressure-sensitive adhesive sheet used in the exemplary embodiment includes seven modes, pressure-sensitive adhesives sheet A to G, as described below.

[0101] (Pressure-Sensitive Adhesive Sheet A)

[0102] Pressure-sensitive adhesive sheet A, when irradiated with a laser beam of within 2 times of the irradiation intensity for forming a through-hole in t...

second exemplary embodiment

[0179] The second exemplary embodiment particularly relates to a mode of laser processing of the work made of metal material, in particular.

[Pressure-Sensitive Adhesive Sheet]

[0180] In this exemplary embodiment, six pressure-sensitive adhesive sheets A′ to F′ described below may be used. Detailed description is omitted as for constituent elements having same functions as the pressure-sensitive adhesive sheets in the first exemplary embodiment.

[0181] (Pressure-Sensitive Adhesive Sheet A′)

[0182] Pressure-sensitive adhesive sheet A′ differs from pressure-sensitive adhesive sheet A only in that the absorption coefficient of laser beam of wavelength of 355 nm is less than 20 cm−1.

[0183] In the case of the work made of metal material, when pressure-sensitive adhesive sheet A′ of the exemplary embodiment shows an absorption coefficient of less than 20 cm−1 in the light of 355 μm, the pressure-sensitive adhesive sheet A′ is less likely to be processed than the work.

[0184] A metal mate...

example 1

[0210] The following examples correspond to pressure-sensitive adhesive sheets A and A′.