Resin compositions with high thermoplatic loading

a technology of thermoplastic resin and composition, applied in the direction of synthetic resin layered products, chemistry apparatus and processes, transportation and packaging, etc., can solve the problems of high viscosity and high tack, resin cannot be fabricated into films or handled during multi-component structure fabrication, and the amount of thermoplastic resins that can be added to the thermoplastic resin mixture is limited

Inactive Publication Date: 2006-12-28
HEXCEL
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Benefits of technology

[0011] In accordance with the present invention, methods and compositions are provided wherein uncured thermosetting resins are initially loaded with relatively high amounts of solid thermoplastic resin particles to form resin precursors. These resin precursors are then heat treated so as to produce uncured resin compositions wherein the thermoplastic resin particles become substa

Problems solved by technology

The amount of thermoplastic resins that can be added to thermosetting resin mixtures is limited by a number of practical considerations relating to processing of the uncured resin.
For example, the resin cannot be fabricated into films or handled during fabrication of multi-component structures if the uncured resin is too tacky.
High viscosity and high tack is a particular problem when uncured toughened resins are used in the fabrication of surface coatings.
High viscosity and high tack cause handling problems that lead

Method used

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  • Resin compositions with high thermoplatic loading
  • Resin compositions with high thermoplatic loading

Examples

Experimental program
Comparison scheme
Effect test

example 1

[0034] A resin precursor was made having the following formulation:

[0035] 27.0 weight percent MY-0510 (N,N-Diglycidyl-4-glycidyloxyaniline)

[0036] 24.9 weight percent GY285 (bis-F epoxy)

[0037] 15.8 weight percent 3,3′-Diaminodiphenylsulfone

[0038] 1.3 weight percent Dicyandiamide

[0039] 13.5 weight percent micronized Polyethersulfone (PES)

[0040] 17.5 weight percent densified Polyethersulfone (PES)

[0041] Precursor resin formulations in accordance with this example may also be made wherein the amounts of MY-510, GY281 and 3,3-DDS are varied by up to ±15%. Also, the amounts of both types of PES may be varied by as much as ±40%. The amount of dicyandiamide may be varied by up to ±50%. The densified PES was made from PES 5003 P, which is available from Sumitomo Chemical Co. Ltd. (Osaka, Japan). The PES was densified in accordance with U.S. Pat. No. 4,945,154. Average particle size was 10-25 microns with no more than 13 weight percent smaller than 5 microns and no more than 4 weight p...

example 2

[0043] The same combination of thermosetting resins and curing agents as set forth in Example 1 were used to make resin precursors that contained 25, 37.5 and 50 weight percent PES. The PES was added in the same manner as Example 1 except that the differences in overall PES loading was accounted for by varying the amount of densified PES that was added. The amount of micronized PES that was initially dissolved was kept constant at 13.5 weight percent. Films of resin precursor were made in the same manner as Example 1. The films were subjected to the same heat treatment step with the same dissolution process being observed. The resulting uncured resin films underwent the same color change from opaque white to translucent amber-brown. The tack of the uncured resin films was also substantially less than the resin precursor films and the final viscosity of the uncured resin films was substantially higher.

example 3

[0044] A three layer uncured electrically conductive composite material as shown in the drawing was made as follows:

[0045] A resin precursor resin film 12 was prepared according to Example 1. The film 12 was combined with an expanded aluminum foil 14 and a prepreg 16 that was composed of 6080-glass fabric (48 gsm) and resin precursor (32 gsm) that was prepared as described in Example 1. The resulting lay-up 10 was heat treated for 5 minutes at 110° C. in order to substantially dissolve the PES particles without curing the 1-up. The resulting uncured electrically conductive composite structure 20 had substantially reduced tack.

[0046] The uncured composite structure 20 was applied as a surfacing layer to a number of composite structures that were each composed of 8 plies of unidirectional prepreg. The unidirectional prepreg contained unidirectional carbon fibers in an uncured epoxy resin matrix. The orientation of the unidirectional plies was −45, 90, 45 and 0. Upon final curing at ...

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Abstract

Uncured thermosetting resins are loaded with relatively high amounts of solid thermoplastic resin particles to form a resin precursor. The resin precursor is heat treated so as to produce an uncured resin composition wherein the thermoplastic resin particles become substantially dissolved in the thermosetting resin without causing cure of the resin mixture. Heat treatment of highly loaded thermosetting resins in accordance with the present invention provides uncured resin compositions that are well suited for use in fabricating composite structures and particularly prepreg for use in lightning protection surface coatings.

Description

BACKGROUND OF THE INVENTION [0001] 1. Field of the Invention [0002] The present invention relates generally thermosetting resin compositions that include varying amounts of one or more thermoplastic resins, which provide elastomeric toughening of the resin. More particularly, the present invention involves compositions and methods wherein the amount of thermoplastic resin in uncured thermosetting resin compositions is maximized to provide desired levels of resin toughening. These relatively high levels of thermoplastic loading are achieved without increasing the viscosity and / or tack of the uncured composition to levels that would render them unsuitable for handling and processing. [0003] 2. Description of Related Art [0004] Thermosetting resins are popular materials that are used in the fabrication of a wide variety of composite materials. Epoxy resins, bismaleimide resins and cyanate ester resins are examples of popular thermosetting resins. Composite materials typically include o...

Claims

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Application Information

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IPC IPC(8): B32B27/38B32B27/04C08L63/00B32B37/00
CPCB32B5/28B32B15/02C08L2205/02B32B15/08B32B15/14B32B27/04B32B27/08B32B27/38B32B2260/021B32B2260/046B32B2274/00B32B2307/202B32B2307/558B32B2307/718B32B2605/18C08G59/3227C08G59/4021C08L63/00C08L81/06C08L81/00Y10T428/24994Y10T428/31511
Inventor MARTIN, CARY JOSEPH
Owner HEXCEL
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