Metal salts of quinolinols and quinolinol derivatives as corrosion inhibitors

Abstract

Adhesive compositions exhibit improved adhesion and conductivity by the addition of a metal salt of 8-quinolinol or of an 8-quinolinol derivative as a corrosion inhibitor. The metal salt of 8-quinolinol or of an 8-quinolinol derivative is formed by coordination with a metal selected from the group consisting of Cu, Be, Mg, Ca, Sr, Ba, Zn, Cd, Al, Ga, In, TI, Yt, La, Pb, Sb, Bi, Cr, Mo, Mn, Fe, Co, Ni, Pd, Ce, and Pr. Examples of quinolinol derivative salts have the structures:

Description

FIELD OF THE INVENTION

[0001] This invention relates to adhesives containing metal salts of quinolinols and quinolinol derivatives as corrosion inhibitors. BACKGROUND OF THE INVENTION

[0002] In the fabrication and assembly of semiconductor packages, an integrated circuit chip or die is attached to a lead frame with adhesive and wire bonding, and the die and inner lead frame assembly encapsulated in a molding resin. After encapsulation, the outer leads of the lead frame are attached to a printed circuit board or other external device. Any exposed metal surfaces, particularly copper, on lead frames or printed wire boards are subject to oxidation with exposure to air and are routinely coated with antioxidants. However, the presence of antioxidants is suspected of interfering with the bonding process during the adhesive, wire bonding, encapsulation, and final soldering operations in the manufacture of the semiconductor package and its attachment to a printed circuit board.

[0003] In cir...

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