Double-effect thermoelectric cooling apparatus

Abstract

A double-effect thermoelectric cooling apparatus is described. The double-effect thermoelectric cooling apparatus includes a heat-dissipating barrel, a wind guide, cooling fins, and a fan. The heat-dissipating barrel further includes a thermoelectric chip-cooling module and heat-dissipating fins disposed therein. The fan drives a part of air passing through the heat-dissipating fins to remove a heat exchanged by the thermoelectric chip-cooling module. One end of the wind guide is coupled to a heat source of an electronic device, for example, a CPU or a graphic card of a computer. Another end of the wind guide is coupled to the fan to guide another part of the air through the cooling fins reducing the temperature thereof to the heat source of the electronic device to reduce the operating temperature of the heat source.

Description

RELATED APPLICATIONS[0001]The present application is based on, and claims priority from, Taiwan Application Serial Number 95203660, filed Mar. 6, 2006, the disclosure of which is hereby incorporated by reference herein in its entirety.FIELD OF THE INVENTION[0002]The present invention generally relates to a double-effect thermoelectric cooling apparatus. More particularly, this invention relates to a double-effect thermoelectric cooling apparatus for a computer system.BACKGROUND OF THE INVENTION[0003]The information technology and the computer industry are technologically highly developed and the semiconductor manufacturing processes have very advanced requirements. Therefore, the electric circuit layouts of semiconductors have become more complicated and more sophisticated. Complicated and sophisticated semiconductors have higher power consumption, which results in an increase in the operating temperature thereof.[0004]However, semiconductor electronic components are used extensivel...

AI Technical Summary

Benefits of technology

[0013]The double-effect thermoelectric cooling apparatus according to the present invention can use a cooling fan to suck external air into the computer to cool a part of the air by the thermoelectric chip-cooling module. The cold air can be directly driven to a heat source, for example, an integrated circuit such as a central processing unit or a graphic chip, to reduce the operating temperature thereof. In addition, another part of the air is driven to the hot side of the thermoelectric chip-cooling module with the same fan to remove the heat exchanged by the thermoelectric chip-cooling module. Accordingly, the double-effect thermoelectric cooling apparatus can effectively reduce the temperature inside the computer and increase the operation stability of the computer.

Problems solved by technology

Therefore, the electric circuit layouts of semiconductors have become more complicated and more sophisticated.

Complicated and sophisticated semiconductors have higher power consumption, which results in an increase in the operating temperature thereof.

The high operating temperature can cause instabilities in a working system.

Furthermore, if the operating temperature is too high, the performance and stability decrease and the operating system may even crash, in extreme situations.

However, when the heat generated by the CPU is removed from the CPU, the heat still resides in the computer.

The larger heat-dissipating device has to occupy more space inside the computer otherwise the stability of the computer system may be reduced because there is too much heat inside the computer.

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