Base Heat Spreader With Fins

Abstract

A thermal management device for the removal of thermal energy useful for, inter alia, electronic devices or other components.

Description

BACKGROUND OF THE INVENTION[0001]1. Technical Field[0002]The present invention relates to a thermal management device useful for applications including cooling electronic components. More particularly, the present invention relates to a base heat spreader with a plurality of fins with improved characteristics for dissipating heat from electronic components such as semiconductor chips so that the components are reduced to a lower temperature state. The invention also includes a novel method for the removal of heat from components including electronic devices of a relatively small size.[0003]2. Background Art[0004]With the advancement of electronic devices being produced in increasingly smaller and smaller sizes coupled with the integration of multiple components into a single unit, cooling electronic devices have become a substantial industry. Specifically, in devices such as central processing units (CPUs) which contain integrated circuit-type electronics, the unit itself contains m...

AI Technical Summary

Benefits of technology

[0032]Another object of the invention is the method of removing heat from an electronic device utilizing a base heat spreader with a plurality of fins including a liquid transfer medium with good wettability characteristics and working fluid.

[0033]These aspects and other that will become apparent to the artisan upon review of the following description can be accomplished by providing a base heat spreader formed of a material providing for the reduction of localized high in

Problems solved by technology

Semiconductors also suffer in that their performance deteriorates when the operating temperature increases to an undesired level around the semiconductor device.

Unfortunately, the problems associated with fan-type technology are multiple, including a relatively low cooling efficiency, a bulky power source and a limited functional size.

Furthermore, with the growing trend of devices which use electronic components becoming smaller and smaller, traditional cooling methods, including fans, are becoming much more limited as both a decrease in size and decrease in the acceptable weight of thermal management systems are necessitated by the industry.

However, methods have developed to replace fan-type cooling devices which are both smaller and located in the immediate vicinity of the electronic device needing to be cooled.

Essentially, the efficient heat-releasing structure

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