Base Heat Spreader With Fins

Abstract

A thermal management device for the removal of thermal energy useful for, inter alia, electronic devices or other components.

Description

BACKGROUND OF THE INVENTION[0001]1. Technical Field[0002]The present invention relates to a thermal management device useful for applications including cooling electronic components. More particularly, the present invention relates to a base heat spreader with a plurality of fins with improved characteristics for dissipating heat from electronic components such as semiconductor chips so that the components are reduced to a lower temperature state. The invention also includes a novel method for the removal of heat from components including electronic devices of a relatively small size.[0003]2. Background Art[0004]With the advancement of electronic devices being produced in increasingly smaller and smaller sizes coupled with the integration of multiple components into a single unit, cooling electronic devices have become a substantial industry. Specifically, in devices such as central processing units (CPUs) which contain integrated circuit-type electronics, the unit itself contains m...

AI Technical Summary

Benefits of technology

[0018]The present invention provides a heat management device which is uniquely capable of use in applications of removing thermal energy from electronic devices wherein space is limited as well as the design orientation. The inventive heat management device provides for the reduction of localized hot spots of thermal energy as well as the even dissipation of thermal energy from the electronic device while providing a combination of improved thermal energy removal with relatively lightweight design characteristics not heretofore seen. In addition, a base heat spreader which receives heat from the electronic device combined with at least one and preferably a plurality of fins having an internal coolant provide a heat management device which can be designed for use in a variety of circumstances including multiple orientations of the heat management device as well as the ability to use the heat management device in machines in a variety of different configurations.

Problems solved by technology

Semiconductors also suffer in that their performance deteriorates when the operating temperature increases to an undesired level around the semiconductor device.

Unfortunately, the problems associated with fan-type technology are multiple, including a relatively low cooling efficiency, a bulky power source and a limited functional size.

Furthermore, with the growing trend of devices which use electronic components becoming smaller and smaller, traditional cooling methods, including fans, are becoming much more limited as both a decrease in size and decrease in the acceptable weight of thermal management systems are necessitated by the industry.

However, methods have developed to replace fan-type cooling devices which are both smaller and located in the immediate vicinity of the electronic device needing to be cooled.

Essentially, the efficient heat-releasing structure includes a plurality of vibrating-type cooling fins extending above the heat exchanging device wherein the vibrating fins reduces the air space accumulated in a heat boundary layer which can hamper the performance of traditional cooling fins.

Unfortunately, heat transfer devices produced by the prior art processes do not provide sufficient heat dissipation for many applications, or require extensive processing cost to construct the thermal management device.

In addition, some of the aforementioned devices can be prone to failure, thus leading to excessive heat as heat transfer is significantly diminished.

One disadvantage of the device of International Application No.

Furthermore, the device does not include sufficient methods to reduce localized hot spots produced by an electronic device and does not adequately transfer thermal energy along the device's entire surface.

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