Fabrication of high surface area, high aspect ratio mini-channels and their application in liquid cooling systems

Abstract

The present invention provides methods and apparatuses which achieve high heat transfer in a fluid cooling system, and which do so with a small pressure drop across the system. The present invention teaches the use of wall features on the fins of a heat exchanger to cool fluid in a fluid cooling system. The present invention also discloses high aspect ratio, high surface area structures applicable in micro-heat exchangers for fluid cooling systems and cost effective methods for manufacturing the same.

Description

FIELD OF THE INVENTION[0001]This invention relates to the field of heat exchangers. More particularly, this invention relates to a method of fabricating heat exchangers having high surface area, high aspect ratio minichannels and / or high aspect ratio microchannels, and their application in fluid cooling systems.BACKGROUND OF THE INVENTION[0002]Effective heat transfer in a fluid cooling system has a flowing fluid in contact with as much surface area as possible of the material that is thermally coupled to extract heat from the device to be cooled. Fabrication of a reliable and efficient High Surface to Volume Ratio Material (HSVRM) structure is therefore extremely critical for developing an effective heat exchanger.[0003]The use of silicon microchannels is one heat collector structure in fluid cooling systems previously proposed by the assignee of the present invention. For example, see U.S. Pat. No. 7,017,654, which issued on Mar. 28, 2006 and entitled “APPARATUS AND METHOD OF FORMI...

AI Technical Summary

Benefits of technology

[0007]The present invention discloses high aspect ratio, high surface area structures applicable in micro-heat-exchangers for fluid cooling systems and cost effective methods for manufacturing the same.

[0010]In some embodiments of the present invention, methods are employed to reduce pressure drop in a heat exchanger. In some embodiments, a unique geometry is provided to divert fluid flow paths in order to reduce pressure drop. In other embodiments, a manifold layer is used to divert fluid flow paths in order to minimize pressure drop.

Problems solved by technology

However, silicon has a low thermal conductivity relative to many other materials, and especially relative to true metals.

Methods for fabrication and designs for micro-heat exchangers from higher conductivity materials exist in the prior art, but either use expensive fabrication technologies or involve complicated structures without specifying economically feasible fabrication methods.

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