Looking for breakthrough ideas for innovation challenges? Try Patsnap Eureka!

Polyurethane composition for cmp pads and method of manufacturing same

a technology of polyurethane composition and cmp pads, which is applied in the direction of lapping machines, grinding devices, other chemical processes, etc., can solve the problems of reducing the stiffness of the pad, increasing the dishing, and reducing the planarization efficiency, so as to simplify the overall fabrication process and reduce the frothing time , the effect of sacrificing foaming characteristics and quality

Inactive Publication Date: 2013-05-23
PRAXAIR ST TECH INC
View PDF13 Cites 1 Cited by
  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Benefits of technology

This patent describes a new type of polishing pad that is used in electronic manufacturing. This pad has certain properties that make it better at polishing and improving the uniformity of the finished product. The pad is made from a special material called polyurethane, which has high energy dissipation and can absorb energy during polishing. This results in a smoother polishing performance, less dishing, and better uniformity. The pad is made using commercially available prepolymers, which simplifies the manufacturing process. Overall, this new pad technology is better suited for high-volume manufacturing and can improve the quality and efficiency of the polishing process.

Problems solved by technology

However, this approach tends to also reduce the stiffness of the pad.
The reduced stiffness results in decreased planarization efficiency and increases dishing due to conformation of the pad around the device corner.

Method used

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
View more

Image

Smart Image Click on the blue labels to locate them in the text.
Viewing Examples
Smart Image
  • Polyurethane composition for cmp pads and method of manufacturing same
  • Polyurethane composition for cmp pads and method of manufacturing same
  • Polyurethane composition for cmp pads and method of manufacturing same

Examples

Experimental program
Comparison scheme
Effect test

example 1

[0081]Sixty thousand (60,000) grams of total prepolymer was measure out. Of this, forty two thousand (42,000) grams of TDI-terminated polyether prepolymer manufactured by Chemtura Corporation and sold under the tradename Adiprene LF 750D was measured, and supplied to the processing tank equipped with variable heating temperature and agitation speed. Separately, (18,000) grams of TDI-terminated polyester prepolymer manufactured by Air Products and Chemicals, Inc. and sold under the name Versathane D-6 was measured and added to the processing tank containing the 42,000 grams of polyether prepolymer.

[0082]Twelve hundred (1,200) grams of silicone surfactant sold as Niax L-5340 by Momentives, Inc. was added to the process tank, and the mixture was agitated with a simple impeller to create a moderate vortex. The process tank is heated to 150° F. under an nitrogen atmosphere.

[0083]In a separate curative process tank, twenty thousand (20,000) grams of diamine curative manufactured by Albema...

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to View More

PUM

PropertyMeasurementUnit
densityaaaaaaaaaa
weight percentaaaaaaaaaa
frothing temperaturesaaaaaaaaaa
Login to View More

Abstract

Polyurethane composition based on a certain polyether and polyester prepolymer reaction mixture, wherein the composition is utilized in manufacturing chemical mechanical polishing / planarizing (CMP) pads. The CMP pads have low rebound and can dissipate irregular energy as well as stabilize polishing to yield improved uniformity and less dishing of the substrate.

Description

[0001]This application is a continuation of prior U.S. application Ser. No. 12 / 537,862, filed Aug. 7, 2009, which is incorporated herein by reference.FIELD OF THE INVENTION[0002]The present invention relates to chemical mechanical polishing / planarization pads based on a novel composition, and method for manufacturing same. Specifically, the CMP pads are polyurethane pads derived from a polyether / polyester prepolymer reaction mixture, wherein the resulting pads exhibit a moderate hardness with high porosity, a high tear resistance and high damping performance.BACKGROUND OF THE INVENTION[0003]Chemical mechanical planarization, also known as chemical mechanical polishing or CMP, is a technique used to planarize the top surface of an in-process semiconductor wafer or other substrates, such as optical, magnetic type of substrates in preparation of subsequent steps or for selectively removing material. The technique employs a slurry that can have corrosive and abrasive properties in conju...

Claims

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to View More

Application Information

Patent Timeline
no application Login to View More
Patent Type & Authority Applications(United States)
IPC IPC(8): B24B37/24
CPCB24B37/24B24D18/00C08G18/10C08G2101/0066C08G18/4854C08G18/7621C08G18/4238C08G2110/0066C08J9/04B24B37/04B24D3/28
Inventor ZHANG, YONGHUANG, DAVIDSUN, LU
Owner PRAXAIR ST TECH INC
Who we serve
  • R&D Engineer
  • R&D Manager
  • IP Professional
Why Patsnap Eureka
  • Industry Leading Data Capabilities
  • Powerful AI technology
  • Patent DNA Extraction
Social media
Patsnap Eureka Blog
Learn More
PatSnap group products

Browse by: Latest US Patents, China's latest patents, Technical Efficacy Thesaurus, Application Domain, Technology Topic, Popular Technical Reports.

© 2024 PatSnap. All rights reserved.Legal|Privacy policy|Modern Slavery Act Transparency Statement|Sitemap|About US| Contact US: help@patsnap.com