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Heat-curable epoxy resin composition for encapsulating optical semiconductor element and optical semiconductor device using same

a technology of epoxy resin and optical semiconductor, which is applied in the field of heat-curable epoxy resin composition for encapsulating optical semiconductor elements, can solve the problems of easy cracking of resin, easy deterioration of molded products, and easy deterioration of encapsulation resin, and achieves favorable mold releasability, high strength and elastic modulus, and easy handling

Inactive Publication Date: 2016-01-28
SHIN ETSU CHEM IND CO LTD
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Benefits of technology

The present invention provides a heat-curable epoxy resin composition for encapsulating an optical semiconductor element which exhibits high strength and elastic modulus even in a high-temperature environment, favorable mold releasability without impairing the transparency of a cured product, and solid under room temperature such that the resin composition can be easily handled. Additionally, by adding a particular mold release agent to the heat-curable epoxy resin composition, it can show a good mold releasability without affecting the transparency of a cured product.

Problems solved by technology

However, when a multifunctional epoxy resin and / or an alicyclic epoxy resin is simply melted for use to improve the heat resistance and light resistance, a decrease in the strength of such encapsulation resin may occur easily.
That is, when using such epoxy resin composition to encapsulate and mold an optical semiconductor element, there exists a problem that the resin may crack easily and a molded product may turn yellow easily as well due to an uneven hardening.
Therefore, even if a heat-curable resin (epoxy resin) has a high glass-transition temperature, the heat-curable resin exhibiting a low strength and elasticity at a high temperature may push a lens portion aside such that the optical semiconductor element may not be able to emit light.
Moreover, there also exists a problem where an epoxy resin for encapsulating an optical semiconductor may solidly adhere to a mold, if used for molding as is the case with the aforementioned epoxy resin composition.
In short, the problem has been that it is extremely difficult to remove a molded package from a mold, since a cured product of the resin composition may solidly adhere to the mold, such cured product being obtained after performing molding using the epoxy resin for encapsulating an optical semiconductor.
However, a problem with such mold release agent is that while there can be achieved a superior transparency of the cured product, an insufficient continuous moldability is exhibited.

Method used

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Examples

Experimental program
Comparison scheme
Effect test

working example

[0066]The present invention is described in detail hereunder with reference to working and comparative examples. However, the present invention is not limited to the following working examples.

[0067]The raw materials used in the working and comparative examples are as follows.

[0068](A-1) tris(2,3-epoxypropyl) isocyanurate (product name: TEPIC-S by Nissan chemical industries, ltd., epoxy equivalent of 100)

[0069](B-1) solid bisphenol A-type epoxy resin (product name: jER-1001 by Mitsubishi Chemical Corporation, epoxy equivalent of 475)

[0070](B-2) solid alicyclic epoxy resin (product name: EHPE-3150 by Daicel Corporation, epoxy equivalent of 170)

[0071](B-3) liquid alicyclic epoxy resin (product name: Celloxide 2021P by Daicel Corporation, epoxy equivalent of 135)

[0072](B-4) solid bisphenol F-type epoxy resin (product name: jER-4004P by Mitsubishi Chemical Corporation, epoxy equivalent of 900)

[0073](C-1) methylhexahydrophthalic anhydride (product name: RIKACID MH by New Japan Chemical C...

working examples 1 to 6

Comparative Examples 1 to 4

[0082]The components (A), (B) and (C) were added at the ratios shown in the following Table 1, followed by performing prepolymerization by melting and mixing the same for 6 hours in a gate mixer that had been heated to 85° C. Subsequently, the component (D) was further added thereto to perform melting and mixing for another 5 min, followed by cooling, solidifying and then crushing a product thus prepared to obtain the target epoxy resin composition in a powdery state.

working examples 7 to 11

And Comparative Examples 8 to 17

[0091]The components (A) to (E) were added at the ratios shown in the following Table 2, followed by melting and mixing the same for 10 min in gate mixer that had been heated to 85° C. A product thus prepared was then cooled to obtain an epoxy resin composition in a state of solid or paste.

[0092]Various properties of such composition were measured as follows. The results thereof are shown in Table 2.

Transparency of Molded Product

[0093]Molded samples obtained by performing transfer molding on the heat-curable epoxy resin were evaluated in accordance with the following standard(s).

∘: transparent molded sample

x: cloudy molded sample

Light Transmittance

[0094]A sheet-like cured product having a thickness of 1 mm was produced at the molding temperature of 175° C. and under the molding pressure of 6.9 N / mm2 for the molding period of 120 seconds. The light transmittance of such cured product at 600 nm was measured with spectrophotometer U-4100 (by Hitachi High...

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Abstract

Provided is a heat-curable epoxy resin composition for encapsulating an optical semiconductor element. The resin composition exhibits a high strength and elastic modulus even in a high-temperature environment, hardly turns yellow due to an uneven hardening that occurs immediately after molding, and is solid under a room temperature such that the resin composition can be handled easily. The resin composition includes: a prepolymer obtained through a reaction of (A) a triazine derivative epoxy resin, (B) at least one epoxy resin selected from a group of (B-1) a bisphenol A-type epoxy resin, (B-2) a bisphenol F-type epoxy resin, (B-3) a hydrogenated bisphenol A-type epoxy resin and (B-4) an alicyclic epoxy resin and (C) an acid anhydride curing agent, at an epoxy group equivalent / acid anhydride group equivalent ratio of 0.6 to 2.0; and (D) a curing accelerator, such resin composition capable of being pressure molded under a room temperature before thermally cured.

Description

BACKGROUND OF THE INVENTION[0001]1. Field of the Invention[0002]The present invention relates to a heat-curable epoxy resin composition for encapsulating an optical semiconductor element. Particularly, the heat-curable epoxy resin composition of the present invention exhibits a favorable mold releasability without impairing the transparency of a cured product, a high strength and elastic modulus even in a high-temperature environment; hardly turns yellow due to an uneven hardening that occurs immediately after molding; and is solid under a room temperature such that the resin composition can be handled easily. Further, the present invention also relates to an optical semiconductor device obtained by encapsulating an optical semiconductor element with such heat-curable epoxy resin composition.[0003]2. Background Art[0004]Optical semiconductor elements such as LEDs (Light Emitting Diode) have been used in various indicators and light sources such as those for street displays, automobi...

Claims

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Application Information

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Patent Type & Authority Applications(United States)
IPC IPC(8): C08L63/00
CPCC08L2205/025C08L63/00C08G59/4215C08G59/4284
Inventor TSUTSUMI, YOSHIHIROTOMITA, TADASHI
Owner SHIN ETSU CHEM IND CO LTD
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