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Display module encapsulation structure and preparation method thereof

Inactive Publication Date: 2016-11-03
EVERDISPLAY OPTRONICS (SHANGHAI) CO LTD
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Benefits of technology

The patent describes a way to make a protective layer for display modules using a thin film encapsulation structure. This method helps to prevent damage to the display and improves its mechanical strength. The process also helps to improve the effectiveness of the protective layer by using bank structures to prevent the diffusion of the inorganic coating and increase the number of water retaining walls. Overall, this method can be used in the manufacturing of AMOLED and other related display devices.

Problems solved by technology

But the above-mentioned electronic devices are extremely prone to be the eroded by moisture and oxygen in the external environment.
Therefore, the package structure is extremely prone to be damaged when an external force is encountered.
Especially during the service lifetime test, the sealing structure is prone to generate gap so that the destructive gas in the external environment penetrates into the sealing structure, causing the display module 12 to be eroded, and even causing the display module 12 to be damaged when an external force is encountered.
In the case, the display devices can't work properly.

Method used

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  • Display module encapsulation structure and preparation method thereof
  • Display module encapsulation structure and preparation method thereof
  • Display module encapsulation structure and preparation method thereof

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Experimental program
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embodiment 1

[0059]FIGS. 2-5 show the schematic diagram of the method for preparing the display module encapsulation structure, comprising the steps of:

[0060]first of all, referring to Figure I, implement an array process for the display devices on the basis of a substrate (such as Low Temperature Poly Silicon) to form the array substrate 21; the above-mentioned array substrate 21 can be provided with a display area and a non display adjacent to the display area. The array substrate 21 on the display area is mainly used for the adhesion and the preparation of the display devices; at the same time, a thin film transistor display circuit can be configured on or within the array substrate 21 to drive the display module that would be prepared subsequently.

[0061]Additionally, a plurality of bank structures 23 are formed on the surface of the array substrate 21 of the non display area adjacent to the display area during the array process, the bank structures 23 can be multilayer thin film stack struct...

embodiment 2

[0075]On the basis of the above embodiment 1, as shown in FIG. 5, this embodiment provides a display module encapsulation structure, the display module encapsulation structure can be used to prepare all kinds of display devices (such as OLED display device), the display module encapsulation structure comprising:

[0076]an array substrate 21, being the substrate with the array process, may include but not limited to LTPS substrate, etc.; the array substrate 21 has a front surface (namely the upper surface, as shown in FIG. 5) and a lower surface opposite to the upper surface (namely the bottom surface, as shown in FIGS. 5 and 6); the material of the substrate can be glass. The array substrate 21 can also be formed by a hard substrate or a flexible substrate. Within the array substrate 21, or on the array substrate 21, can be arranged a driving circuit for driving the display module to emit light.

[0077]Additionally, the array substrate 21 is configured with a display area used for arran...

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Abstract

A display module encapsulation structure and preparation method thereof, which relates to the field of display devices and can be applied in preparing AMOLED and other related display devices. The structure and method thereof mainly seals and protects the display module by utilizing the thin film encapsulation structure. That is to say, seal the display module by inorganic thin film layer which has the characteristics of transparency as well as water-resistance oxygen, buffer the internal and external stress of the thin film layer by preparing the organic module outside to the inorganic thin layer, and restrain the film layer falling off caused by the bending stress when making flexible devices. The thin film encapsulation instead of fit encapsulation can effectively improve the mechanical strength of the whole display device.

Description

CROSS-REFERENCE TO RELATED APPLICATIONS[0001]The present application claims priority to and the benefit of U.S. Provisional Application No. 62 / 154,866, filed on Apr. 30, 2015, the entire content of which is incorporated herein by reference.BACKGROUND OF THE INVENTION[0002]1. Field of the Invention[0003]The invention relates to the field of display devices, and more particularly, to a display module encapsulation structure and the preparation method thereof.[0004]2. Description of the Related Art[0005]Among the display devices of an electronic device, display devices for generating a light source, such as light emitting diode (LED) or organic light emitting diode (OLED), are the key devices keeping the normal operation of the display device. But the above-mentioned electronic devices are extremely prone to be the eroded by moisture and oxygen in the external environment. Therefore, the electronic devices should be isolated and protected in order to ensure the normal operation of elec...

Claims

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Application Information

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IPC IPC(8): H01L51/52H01L27/32
CPCH01L51/5253H01L51/56H01L2227/323H01L27/3246Y02E10/549Y02P70/50H10K59/40H10K59/12H10K50/8445H10K50/841H10K50/844H10K59/1213H10K77/10H10K50/8426H10K2102/3026H10K71/00H10K71/135H10K50/8428H10K2102/351H10K50/84H10K50/85H10K59/17H10K59/122H10K85/111H10K85/141H10K59/1201H10K85/10H10K2102/00H01L29/78672
Inventor HO, HSINJUWU, CHIENLINJIANG, HUAN
Owner EVERDISPLAY OPTRONICS (SHANGHAI) CO LTD