Electronic module with free-formed self-supported vertical interconnects

Abstract

An electronic module, and method for making same, includes free-formed, self-supported interconnect pillars that electrically connect cover electronic components disposed on a cover substrate with base electronic components disposed on a base substrate. The free-formed, self-supported interconnect pillars may extend vertically in a straight path between the cover electronic components and the base electronic components. The free-formed, self-supported interconnect pillars may be formed from an electrically conductive filament provided by an additive manufacturing process. By free-forming the self-supported interconnect pillars directly on the electronic components, the flexibility of electronic module design may be enhanced, while reducing the complexity and cost to manufacture such electronic modules.

Description

FIELD OF INVENTION[0001]The present invention relates generally to electronic modules, and more particularly to RF modules having free-formed, self-supported electrical interconnects.BACKGROUND[0002]Electronic modules, such as radio frequency (RF) modules, contain electronic components, such as high-frequency chipsets, that may take up a considerable amount of space inside the module and may generate a significant amount of heat. RF modules in a planar phased array antenna architecture are typically mounted on a base substrate and the available area for integrating such modules is often constrained. Typically, cooling is applied through the bottom of the module via a thermal mass or a restricted cold plate, which may interfere with RF operation due to the cold plate or thermal mass being in the direct path of electrical signals on the planar phased array antenna. As electronic components for RF modules become increasingly complex, there is a need to improve the available surface are...

AI Technical Summary

Benefits of technology

The patent describes a new design for electronic modules that uses free-formed, self-supported interconnect pillars to improve their performance and compactness. These interconnect pillars provide a straight path for electrical signals between electronic components, reducing transmission losses and improving operational efficiency. The design also integrates a thermal spreader for improved cooling while minimizing interference with electrical connections. The interconnect pillars can be formed from an electrically conductive filament using a layer-wise additive manufacturing process, which enhances design flexibility and reduces manufacturing complexity.

Problems solved by technology

Electronic modules, such as radio frequency (RF) modules, contain electronic components, such as high-frequency chipsets, that may take up a considerable amount of space inside the module and may generate a significant amount of heat.

Typically, cooling is applied through the bottom of the module via a thermal mass or a restricted cold plate, which may interfere with RF operation due to the cold plate or thermal mass being in the direct path of electrical signals on the planar phased array antenna.

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