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61results about How to "Available area" patented technology

Embedded heat spreader ball grid array

A heat slug or spreader is attached directly to a surface of the die in a ball grid array (BGA) package. The heat spreader roughly conforms to the topological profile of the die, underlying substrate, and electrical interconnections between the die and the substrate, such as bond wires. The outer portion of the heat spreader substantially cover the outer portion of the substrate, or alternatively, cover only those portions extending in laterally from the sides of the chip and not the corners. An encapsulant completely covers the heat spreader and die.
Owner:AMKOR TECH SINGAPORE HLDG PTE LTD

Laminated sheet manifold for microchannel heat exchanger

A heat exchanger can have a manifold which includes a plurality of laminated sheets that allow a customization of the heat exchanger. The design can allow for a more optimal flow of coolant to areas of high load, thereby making the temperature distribution across the heat exchanger more uniform, or intentionally non-uniform. Furthermore, the laminated sheets can allow multiple circuits to be employed in the heat exchanger such that different coolants can be utilized therein and maintained separate from one another. The tubes can be microchannel tubes. A single set of manifolds can be used with multiple heat exchanger cores to provide a more compact heat exchanger. Mounting features can be integral with a group of the sheets.
Owner:VERTIV CORP

Semiconductor package substrate having bonding pads with plated layer thereon and process of manufacturing the same

A semiconductor package substrate is provided having a plurality of bonding pads on at least one surface thereof and covered by a conductive film. A photoresist layer formed over the conductive film has a plurality of first openings for exposing portions of the conductive film corresponding to the bonding pads. The exposed portions of the conductive film is removed to expose the bonding pads respectively via the first openings. The exposed bonding pads are plated with a metal layer respectively. Then, the photoresist layer and the remainder of the conductive film covered by the photoresist layer are removed. A solder mask having a plurality of second openings may be formed on the surface of the substrate, and allows the plated metal layer on the bonding pads respectively to be exposed via the second openings.
Owner:PHOENIX PRECISION TECH CORP

Cell searching method and mobile terminal therefor

A cell searching method and mobile terminal for a mobile communication system is provided. The terminal and method facilitate cell searching by using a database that registers cell information, such as frequencies and identities. A cell searching method of a mobile terminal according to the present invention includes determining whether authentication information of at least one cell exists in a memory, selecting, when the authentication information exists, the authentication information of the at least one cell, evaluating validity of the selected authentication information and attempting to camp on the cell using the authentication information if the validity evaluation is successful.
Owner:SAMSUNG ELECTRONICS CO LTD

Image Sensor ADC and CDS per Column

A solid state imager converts analog pixel values to digital form on an arrayed per-column basis. A counter is coupled to an N-bit DAC to produce an analog ramp that varies corresponding to the contents of the counter. A ripple counter is associated with each respective column. A clock or a source of counts at a predetermined sequence supplies clock signals or counts to the counter elements. Column comparators gate the counter elements when the analog ramp equals the pixel value. The counter contents feed a video output bus to produce the digital video signal. Additional black-level readout counters elements can create and store a black level digital value that is subtracted from the pixel value to reduce fixed pattern noise. The counters may employ two's complement arithmetic. An additional array of buffer counter / latches can be employed. Ripple counters can be configured as counters to capture the digital video level, and then as shift registers to clock out the video levels to an output bus. The clock pulses or counts for the DAC counter and for the ripple counters can be at the same or different rates.
Owner:DYNAMAX IMAGING

Laminated sheet manifold for microchannel heat exchanger

A heat exchanger can have a manifold which includes a plurality of laminated sheets that allow a customization of the heat exchanger. The design can allow for a more optimal flow of coolant to areas of high load, thereby making the temperature distribution across the heat exchanger more uniform, or intentionally non-uniform. Furthermore, the laminated sheets can allow multiple circuits to be employed in the heat exchanger such that different coolants can be utilized therein and maintained separate from one another. The tubes can be microchannel tubes. A single set of manifolds can be used with multiple heat exchanger cores to provide a more compact heat exchanger. Mounting features can be integral with a group of the sheets.
Owner:VERTIV CORP

Aerofoil blade or vane

An aerofoil blade or vane for the turbine of a gas turbine engine includes: an aerofoil leading edge; an aerofoil trailing edge; an aerofoil suction side; and at least one reverse-pass coolant passage, extending within the aerofoil blade or vane; wherein the at least one reverse-pass coolant passage includes a substantial reverse-pass portion in which, in use, coolant flows in a direction away from the trailing edge and towards the leading edge.
Owner:ROLLS ROYCE PLC

Method for sorption and desorption of molecular gas contained by storage sites of nano-filament laded reticulated aerogel

A system and method for sorption and desorption of molecular gas contained by storage sites of graphite nano-filaments randomly disposed in three-dimensional reticulated aerogel.
Owner:ENERNEXT +3

Apparatuses and methods for iris imaging

The invention includes a method and apparatus for acquiring an image of a subject's iris, within the near infrared region of the electromagnetic spectrum. Near infrared radiation is generated from an incandescent light source, having wavelengths spread across 700 nm to 900 nm. The iris is illuminated for imaging by directing the generated near infrared radiation along an optical path between the incandescent light source and an intersection of a field of view region and depth of field region of an iris camera. Near infrared radiation scattered by the iris and transmitted along the iris camera's optical axis is received at the iris camera. An image of the iris is then acquired at the iris camera, based on radiation scattered by the iris and received at the iris camera.
Owner:DELTA ID

Microarray and microarray substrate

To provide microarray capable of readily and securely making the shape of spot of probe DNA to be fixed into a desired shape. A microarray 2 of which substrate is a slide glass has a hydrophilic region 3 where the surface is hydrophilic and a probe DNA is fixed, and a hydrophobic region 4 where a probe DNA is not fixed and the surface is hydrophobic, around the hydrophilic region 3. When a solution containing the probe DNA is dropped by a spotter 5, the solution spreads in the hydrophilic region 3 while being prevented from further spreading by the hydrophobic region 4. As a result of this, it is possible to arbitrarily determine the shape of the spot, which is the hydrophilic region 3.
Owner:HITACHI SOFTWARE ENG

Flip chip packaging process

A flip chip packaging process uses an underfill as an encapsultant to reduce the possibility of delamination from occurring due to differential coefficients of thermal expansion, and thus the reliability of a flip chip package structure can be increased. Furthermore, the flooding of the encapsulant over the cutting line need not be taken into consideration for cutting the substrate. Therefore, the usage area of the substrate usage is increased, i.e., more chips can be mounted per unit area of the substrate.
Owner:ADVANCED SEMICON ENG INC

Liquid crystal display panel and method for repairing signal line thereof

A display panel and a method for repairing signal lines thereof are disclosed. The display panel includes at least one shorting bar, switches, and auxiliary repair lines. The switches are electrically coupled respectively to signal lines and the at least one shorting bar. Both ends of each of the auxiliary repair lines overlap one of connections between the switches and the at least one shorting bar. When a signal line is damaged, the method for repairing includes: breaking off each of the connections between each of the switches and the at least one shorting bar by cutting; and welding both ends of one of the auxiliary repair lines which correspond to the damaged signal line with both sides of one of the connections which correspond to the damaged signal line.
Owner:CHUNGHWA PICTURE TUBES LTD

Package structure for integrated circuit device and method of the same

The present invention discloses a package structure for an integrated circuit device and method for manufacturing the same. The method includes providing a wafer with multiple integrated circuit devices; providing an extendable substrate having a first surface supporting the wafer; forming multiple anti-elongation layers on a second surface of the extendable substrate, the second surface being opposite to the first surface; forming multiple recesses in the wafer for separating the integrated circuit devices from each other; elongating the extendable substrate to enlarge the multiple recesses; and forming an insulating layer to fill the recesses and cover multiple integrated circuit devices.
Owner:MUTUAL PAK TECH

Semiconductor package substrate having bonding pads with plated layer thereon and process of manufacturing the same

A semiconductor package substrate is provided having a plurality of bonding pads on at least one surface thereof and covered by a conductive film. A photoresist layer formed over the conductive film has a plurality of first openings for exposing portions of the conductive film corresponding to the bonding pads. The exposed portions of the conductive film is removed to expose the bonding pads respectively via the first openings. The exposed bonding pads are plated with a metal layer respectively. Then, the photoresist layer and the remainder of the conductive film covered by the photoresist layer are removed. A solder mask having a plurality of second openings may be formed on the surface of the substrate, and allows the plated metal layer on the bonding pads respectively to be exposed via the second openings.
Owner:PHOENIX PRECISION TECH CORP

Cooling apparatus and cooling method for power-pack in hybrid vehicle

A cooling apparatus for a power-pack in a hybrid vehicle may include a power-pack that acquires traveling information of the vehicle and controls the operation of an engine and a motor, a low-temperature radiator that is connected with power-pack through a cooling water channel, dissipates heat from the cooling water discharged from power-pack, and is arranged in parallel with a radiator, and an electric water pump that is disposed in the cooling water channel and operated in response to an electric signal output from an ECU to circulate the cooling water through power-pack and low-temperature radiator. The cooling apparatus may also include a cooling fan. A cooling method of using the cooling apparatus may include determining engine operation, determining start of a water pump, and operating a water pump. The cooling method may also include starting a cooling fan, operating a cooling and examining a water pump.
Owner:HYUNDAI MOTOR CO LTD

Electronic module with free-formed self-supported vertical interconnects

An electronic module, and method for making same, includes free-formed, self-supported interconnect pillars that electrically connect cover electronic components disposed on a cover substrate with base electronic components disposed on a base substrate. The free-formed, self-supported interconnect pillars may extend vertically in a straight path between the cover electronic components and the base electronic components. The free-formed, self-supported interconnect pillars may be formed from an electrically conductive filament provided by an additive manufacturing process. By free-forming the self-supported interconnect pillars directly on the electronic components, the flexibility of electronic module design may be enhanced, while reducing the complexity and cost to manufacture such electronic modules.
Owner:RAYTHEON CO

Method and apparatus for producing grating, and DFB solid-state dye laser based on the grating

To provide a DFB solid-state dye laser including a grating having Moire interference fringes. A DFB solid-state dye laser element includes: a laser medium containing an organic dye; and a distribution feedback type resonance unit having a third grating including a Moire fringe corresponding to an overlap between a first grating and a second grating formed in different directions. The third grating including a Moire fringe is formed by irradiating a photoresist with a laser for two-beam interference exposure, and then rotating a substrate by a predetermined angle and re-irradiating the substrate with the laser.
Owner:MINEBEA CO LTD

Work top and household appliance having a laundry hanging device

InactiveUS20120293052A1Reduced flexibilityDistract from aesthetic appearanceKitchenware cleanersWash-standsEngineeringHome appliance
A domestic household laundry appliance including a housing having a door for accessing an interior of the housing, and an attachment device on the housing, the attachment device for securing and supporting a laundry hanger device. The laundry hanger device is releasably secured in the attachment device.
Owner:BSH HOME APPLIANCES CORP

Package structure for integrated circuit device and method of the same

The present invention discloses a package structure for an integrated circuit device and method for manufacturing the same. The method includes providing a wafer with multiple integrated circuit devices; providing an extendable substrate having a first surface supporting the wafer; forming multiple anti-elongation layers on a second surface of the extendable substrate, the second surface being opposite to the first surface; forming multiple recesses in the wafer for separating the integrated circuit devices from each other; elongating the extendable substrate to enlarge the multiple recesses; and forming an insulating layer to fill the recesses and cover multiple integrated circuit devices.
Owner:MUTUAL PAK TECH

LED lamp

An LED lamp includes: a lamp shell; a passive heat dissipating element having a heat sink, and the heat sink including fins and a base and connecting to the lamp shell; a power source disposed in the lamp shell; and a light board connecting to the heat sink and including LED chips electrically connected to the power source. A chamber of the lamp shell is formed with a first heat dissipating channel. The first heat dissipating channel has a first air inlet at an end of the lamp shell. Another end of the lamp shell has a heat dissipating hole. A second heat dissipating channel is formed in the fins and base. The second heat dissipating channel has a second air inlet. Air flows into the second air inlet, passes through the second heat dissipating channel and flow out from spaces between every adjacent two of the fins.
Owner:JIAXING SUPER LIGHTING ELECTRIC APPLIANCE
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