61results about How to "Available area" patented technology

A portable electronic device (100) has a cover part (102) carrying a display (112) connected to a base part (104) carrying a keyboard (118) by means of a hinge arrangement (106). The cover part can move relatively to the base part from a closed configuration to an open configuration. The hinge arrangement comprises a plurality of elongate connecting elements (122, 124, 126, 128) connected at one end to the cover part and at another end to the base part. Each connecting element is relatively moveable about a first axis of rotation (134, 138) with respect to the cover part and relatively moveable about a second axis of rotation (136, 140) with respect to the base part. In moving from the closed configuration to the open configuration, the cover part is able to rotate about the first axis of rotation and move about the second axis of rotation.

Various embodiments described herein involve making connections with the display leads on more than one side of the display array, e.g., on 2 sides, 3 sides or all 4 sides of the display array. By making connections with the display leads on more than one side of the display array, the available area for bonding leads and control circuitry may be increased. The driver chip(s), discrete components, and other active components necessary for addressing the display panel may be attached to the top or the bottom of a flexible printed circuit (“FPC”) or a similar device. Some embodiments involve attaching an FPC to the display such that that the backplate is substantially encased by the FPC.

A solid state imager converts analog pixel values to digital form on an arrayed per-column basis. An N-bit counter supplies an N-bit DAC to produce an analog ramp output with a level that varies corresponding to the contents of the counter. A latch / counter or equivalent is associated with each respective column. A clock supplies clock signal(s) to the counter elements. When the analog ramp equals the pixel value for that column, the latch / counter latches the value. The black level can be pre-set in the latch / counter or can be subtracted separately to reduce fixed pattern noise. The pixels can be oversampled for some number of times, e.g., n=16, to reduce the thermal noise of the sensors. Also, two or more pixels sharing a common sense node may be binned together, and two (or more) pixels having different integration times may be combined to obtain an output signal with enhanced dynamic range.

A solid state imager converts analog pixel values to digital form on an arrayed per-column basis. An N-bit counter supplies an N-bit DAC to produce an analog ramp output with a level that varies corresponding to the contents of the counter. A ripple counter or equivalent is associated with each respective column. A clock supplies clock signals to the counter elements. A comparator in each column gates the counter element when the analog ramp equals the pixel value for that column. The contents of the counters are transferred sequentially to a video output bus to produce the digital video signal. Additional black-level readout counter elements can create and store a digital value that corresponds to a dark or black video level. A subtraction element subtracts the black level value from the pixel value to reduce fixed pattern noise. An additional array of buffer counter / latches can be employed. The ripple counters can be configured as counters to capture the digital video level, and then as shift registers to clock out the video levels to an output bus. The clock pulses for the DAC counter and for the ripple counters can be at the same or different rates.

A flip chip packaging process uses an underfill as an encapsultant to reduce the possibility of delamination from occurring due to differential coefficients of thermal expansion, and thus the reliability of a flip chip package structure can be increased. Furthermore, the flooding of the encapsulant over the cutting line need not be taken into consideration for cutting the substrate. Therefore, the usage area of the substrate usage is increased, i.e., more chips can be mounted per unit area of the substrate.

An apparatus and method for sorption and desorption of molecular gas contained by storage sites of graphite nano-filaments randomly disposed in three-dimensional reticulated aerogel.

Shielding cases each include a pair of opposed first surfaces with catching pieces protruding therefrom and a pair of second surfaces without catching pieces. A motherboard forms substrates each including a pair of opposed first side surfaces with catching grooves and a pair of second side surfaces without catching grooves when it is divided. The shielding cases are mounted on the motherboard such that the intervals A between the second surfaces of two adjacent shielding cases are equal to or less than the widths B of cutting allowances for cutting the motherboard. The motherboard is cut from the opposite side of a surface of the motherboard on which the shielding cases are mounted at predetermined positions where the second side surfaces are formed on each substrate. In this manner, the motherboard is divided into electronic components with shielding cases.

An apparatus and method for sorption and desorption of molecular gas contained by storage sites of graphite nano-filaments randomly disposed in three-dimensional reticulated aerogel.

A handheld electronic device including a first body, a second body, a flexible electrical connecting means and a cover is provided. The second body is slidely coupled to the first body. The flexible electrical connecting means is electrically connected between the first body and the second body and the cover is slidely coupled to the second body. The cover is located at a first position on the second body when the first body and the second body are in a stacked state. The cover shields the flexible electrical connecting means exposed due to the movement of the second body against the first body when the first body and the second body are in a spread state. Therefore, reliability and appearance of the handheld electronic device can be improved. In addition, available area on the handheld electronic device in the spread state can be increased, to provide higher design flexibility.

An electronic module, and method for making same, includes free-formed, self-supported interconnect pillars that electrically connect cover electronic components disposed on a cover substrate with base electronic components disposed on a base substrate. The free-formed, self-supported interconnect pillars may extend vertically in a straight path between the cover electronic components and the base electronic components. The free-formed, self-supported interconnect pillars may be formed from an electrically conductive filament provided by an additive manufacturing process. By free-forming the self-supported interconnect pillars directly on the electronic components, the flexibility of electronic module design may be enhanced, while reducing the complexity and cost to manufacture such electronic modules.

An input unit having three-dimensionally arranged keys for an electronic device is proposed. The input unit has at least a plurality of keys, the keys are classified into a plurality of groups and respectively arranged on different planes of the input unit according to the operating functions and properties, so as to extensively arrange the keys on different planes of the input unit, which increases the available area on which the keys can be arranged. The functions of the keys can be identified by users touching on them and locating their relative orientations on the input unit, facilitating the input operations and reducing the probability of mistakenly pressing the wrong keys.