Wet processing system and method of operating

Abstract

An electrochemical deposition system having two or more electrochemical deposition modules arranged on a common platform and configured for depositing one or more metals on a substrate is described. Each electrochemical deposition module includes an anode compartment configured to contain a volume of anolyte fluid, a cathode compartment configured to contain a volume of catholyte fluid, and a membrane separating the anode compartment from the cathode compartment. Each electrochemical deposition module further includes a workpiece holder configured to hold opposing edges of a flexible workpiece between first and second leg members via a clamping mechanism, and a loader module configured to position the flexible workpiece in the workpiece holder while holding the flexible workpiece using an air cushion on each opposing planar surface of the flexible workpiece.

Description

BACKGROUND OF THE INVENTION[0001]This invention relates to methods and systems for electro-chemical deposition including electroplating of various workpieces, such as semiconductor substrates.[0002]Electrochemical deposition systems, or workpiece surface wet process conditioning systems, are well known for both wafer type geometries (e.g., semiconductor wafers), characterized by relatively rigid silicon circular disks, and for panel type geometries, characterized by much larger and more flexible rectangular shaped substrates. There is a need in the industry for equipment that can process the panel workpiece with a resulting precision of deposited metal comparable to that resulting from the various wafer equipment, and yet has the economical productivity comparable or better than existing panel processing equipment.[0003]Electrochemical deposition (ECD), among other processes, is used as a manufacturing technique for the application of films to various structures and surfaces, such a...

AI Technical Summary

Benefits of technology

The patent describes an electrochemical deposition apparatus that can handle workpieces better, control the environment better, and manage chemicals more reliably and uniformly for plating. This system also reduces particle contamination and improves process performance with higher yield. The simplified chemical flow management reduces costs and complexity. Additionally, the system has chemical generation systems on board or off board for easier management of chemical concentration.

Problems solved by technology

As indicated above, panel processing systems, in part as a result of their conveyor systems, suffer from poor process uniformity and particle generation.

More generally, these systems suffer from poor environment control.

And, when such replenishment cannot be performed in-situ, the replenishment procedure may be expensive as a function of the application, and may require significant down time of the electrochemical deposition tool or sub module for service and process re-qualification, which adversely affects the cost of ownership of the deposition tool.

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