Resin composition for plating, and plated molded article

Abstract

To provide a resin composition for plating and a plated molded article which are excellent in impact resistance and fluidity and which satisfy plating adhesion strength, plating deposition rate and thermal cycle resistance in a well-balanced manner.A resin composition for plating, containing a polycarbonate resin (A), a graft copolymer (B) and a copolymer (C), wherein the resin composition satisfies the following conditions (1) to (5):(1) a content of the polycarbonate resin (A) is 20 to 60% by mass based on 100% by mass of a total of (A), (B) and (C);(2) the graft copolymer (B) is a graft copolymer obtained by graft polymerization of a rubbery polymer and a monomer component including an aromatic vinyl-based monomer;(3) the copolymer (C) is a copolymer obtained by polymerization of a monomer component including an aromatic vinyl-based monomer and a vinyl cyanide-based monomer;(4) a content of the rubbery polymer is 7 to 20% by mass relative to the resin composition; and(5) a content of an oligomer component is less than 1% by mass relative to the resin composition.

Description

TECHNICAL FIELD[0001]The present invention relates to a resin composition for plating and a plated molded article which are excellent in impact resistance and fluidity and which satisfy plating adhesion strength, plating deposition rate and thermal cycle resistance in a well-balanced manner.BACKGROUND ART[0002]A composition including a polycarbonate resin and an ABS-based resin (hereinafter, designated as “PC / ABS-based resin”) is excellent in impact resistance, heat resistance and moldability, and thus is used in various applications including automobile parts, home appliances, and office equipment parts. In particular, automobile parts and the like tend to be increased in sizes and tend to be designed so as to have more complicated shapes. In addition, molded articles tend to be designed so as to be thinner in thickness for the purpose of a reduction in automobile weight, and therefore a material excellent in performances such as moldability, impact resistance and heat resistance i...

AI Technical Summary

Benefits of technology

The present invention provides a resin composition for plating and a plated molded article that have good impact resistance, flowability, and meet requirements for plating adhesion strength, plating deposition rate, and thermal cycle resistance. The plating method used is direct plating.

Problems solved by technology

An electroless plating solution for use in the method, for example, an electroless nickel plating solution, however, contains hypophosphite as a reducing agent and the hypophosphite has an effect on environmental problems, and therefore the following problems are caused: measures to phosphorus regulations need to be made, effluent regulations are very critical due to high-COD wastewater, and the cost for treating wastewater is very increased.

An additional problem is that the work environment is deteriorated due to the odor of ammonia used for pH adjustment.

Moreover, formalin is also used as a reducing agent in an electroless copper plating solution, but the use of formalin is pointed out to have the problem of having adverse effects on various health and environmental problems.

Furthermore, a strong complexing agent for solubilizing copper ions in an alkaline solution is used in the plating solution, and there are various problems, for example, a very increased cost for treating wastewater for removal of metal ions in a treatment of wastewater of the plating solution.

While a PC / ABS-based resin used in a conventional resin plating method may also be commonly used for such a direct plating method in some cases, the PC / ABS-based resin tends to be hardly deposited on the surface of a molded article in an electrolytic copper plating step of the direct plating method, to easily cause an unplated portion designated as a skip, and a problem is that such a tendency is extremely highly seen particularly in a molded article having a complicated product shape.

As a PC-based resin composition for electroless plating, excellent in electroless plating characteristics, Japanese Patent Laid-Open No. 8-269313 (Patent Literature 3) discloses a resin composition for electroless plating where the resin composition includes a polycarbonate-based resin and a copolymer which is formed from an aromatic vinyl monomer, a vinyl cyanide monomer and a rubbery polymer and whose graft ratio is defined, but such a resin composition cannot sufficiently satisfy plating deposition rate in the direct plating method.