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Fine copper particles, method for producing fine copper particles and method for producing sintered body

a technology of fine copper particles and body, which is applied in the direction of metal/alloy conductors, conductors, transportation and packaging, etc., can solve the problems of easy migration, high cost, and silver has problems, and achieve the effect of suppressing deterioration, reducing sintering temperature, and reducing cos

Inactive Publication Date: 2020-03-05
NIPPON SANSO CORP
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Benefits of technology

The present invention provides fine copper particles that have a coating film containing cuprous oxide and an average film thickness of 1.5 nm or less. This coating film effectively prevents deterioration due to oxidation, even when stored in the air. Moreover, the coating film facilitates a lower sintering temperature of the fine copper particles, which makes them ideal for use in high-density wiring or the like on the surface of a resin substrate having low heat resistance. This results in reduced costs for electronic devices, printed wiring boards, and the like. The method for producing the fine copper particles includes adjusting the mixing ratio between combustible gas and combustion supporting gas to form the coating film containing cuprous oxide on the entire surface of the fine copper particles. Additionally, the method utilizes a reducing atmosphere of 150° C or lower during sintering, further enhancing the use of the fine copper particles in high-density wiring applications and reducing costs.

Problems solved by technology

However, silver has problems such as high cost and easy migration.
On the other hand, metal fine particles have a problem that they tend to deteriorate due to oxidation when left in the atmosphere.
Thus, when the sintering temperature of the metal fine particles increases, for example, when a conductive ink or a conductive paste containing the metal fine particles is used in a printed wiring board or the like having a resin substrate, a resin material having low heat resistance such as a PET film or the like cannot be used.
For this reason, when using a conductive ink or a conductive paste containing metal fine particles, it is necessary to use a material having high heat resistance such as polyimide for the resin substrate, which causes a cost increase.

Method used

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  • Fine copper particles, method for producing fine copper particles and method for producing sintered body
  • Fine copper particles, method for producing fine copper particles and method for producing sintered body
  • Fine copper particles, method for producing fine copper particles and method for producing sintered body

Examples

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example 1

[0119]In Example 1, fine copper particles P were produced by the procedure explained below using a producing apparatus 50 as shown in FIG. 2 (including the burner 3 shown in FIGS. 3 and 4) under conditions shown in Tables 1 and 2 below (see also Example 1 in Table 3).

[0120]In Example 1, 100% methane gas as shown in Table 1 below was used as the combustible gas G1 supplied from the combustible gas supply unit 1 to the burner 3 through the feeder 2, and the flow rate was adjusted to 2.35 Nm3 / h.

[0121]Moreover, 100% oxygen gas was used as the combustion supporting gas G2 supplied from the combustion supporting gas supply unit 4, the flow rate was adjusted to 2.82 Nm3 / h, and the oxygen ratio was adjusted to 0.60.

[0122]In Example 1, the mixing ratio between the combustible gas G1 and the combustion supporting gas G2 was adjusted so that the volume ratio of CO / CO2 in the combustion exhaust gas G3 generated by the combustion of the burner 3 was 1.78.

[0123]In Example 1, copper (I) oxide powd...

examples 2 to 7

, and Comparative Examples 1 to 11

[0136]In Examples 2 to 7 and Comparative Examples 1 to 11, fine copper particles P were produced and evaluated under the same conditions and procedures as in Example 1, except that the combustible gas shown in Table 3 was used, and the volume ratio of CO / CO2 in the combustion exhaust gas G3 was adjusted shown in Table 3. The results were shown in Table 3.

[0137]Specifically, in Examples 2 to 7 and Comparative Examples 1 to 11, any one of 100% methane gas, 80% methane gas +20% hydrogen gas, 60% methane gas +40% hydrogen gas, and 100% propane gas was used as the combustible gas G1. The volume ratio of CO / CO2 in the combustion exhaust gas G3 was adjusted to satisfy the conditions shown in Table 3 by changing the flow rate of the combustion supporting gas G2 while maintaining the flow rate of the combustible gas G1 constant.

[0138]In Examples 2 to 7 and Comparative Examples 1 to 11, a sintered body was also produced by sintering the fine copper particles ...

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Abstract

One object of the present invention is to provide fine copper particles which are less likely to be deteriorated by oxidation in the atmosphere without being coated with an antioxidant or the like and which can be sintered at a lower temperature. The present invention provides fine copper particles wherein an entire surface is covered with a coating film containing cuprous oxide and having an average film thickness of 1.5 nm or less.

Description

FIELD OF THE INVENTION[0001]The present invention relates to fine copper particles, a method for producing fine copper particles, and a method for producing a sintered body.DESCRIPTION OF RELATED ART[0002]In recent years, for example, technological innovations such as high-density wiring have become remarkable with the increase in performance, miniaturization, and weight reduction of electronic devices and printed wiring boards used in electronic component devices. Examples of a material for forming such a high-density wiring include a conductive ink and a conductive paste. These materials contain fine silver particles in order to impart conductivity. However, silver has problems such as high cost and easy migration. For this reason, it is considered to use fine copper particles which are low in cost and have the same conductivity as that of silver instead of silver fine particles.[0003]On the other hand, metal fine particles have a problem that they tend to deteriorate due to oxida...

Claims

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Application Information

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Patent Type & Authority Applications(United States)
IPC IPC(8): B22F1/02B22F1/00B22F3/10B22F1/054B22F1/145B22F1/16
CPCB22F3/1007B22F2301/10B22F1/02B22F1/0018B22F2302/25B22F2304/058B22F2999/00H01B1/026B22F1/054B22F1/16B22F1/145B22F1/056B22F2201/01C22C1/04H01B1/02H01B5/00H01B13/00B22F1/07B22F2304/056B22F2304/054B22F9/22B22F2201/013B22F2201/04
Inventor SAKURAMOTO, YUJIIGARASHI, HIROSHIFUJIMOTO, TAKAYUKI
Owner NIPPON SANSO CORP