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Vapor deposition mask, vapor deposition method, and production method for organic el display device

a technology of organic el and vapor deposition mask, which is applied in the direction of vacuum evaporation coating, electroluminescent light sources, coatings, etc., can solve the problems of being subjected to etching, and achieve the effect of enduring a large stress, sufficient rigidity, and sufficient rigidity

Inactive Publication Date: 2021-03-11
SAKAI DISPLAY PROD
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Benefits of technology

The present invention provides a frame for a device that has sufficient rigidity to withstand large stresses. The frame is made up of a columnar-shaped body formed by stacking unit structure bodies with a sandwich structure. The columnar-shaped frame has a honeycomb structure with hexagonal through holes arranged in parallel, which demonstrates rigidity even to a very large stress. The columnar-shaped frame also has a vacant space that reduces weight and suppresses heat conduction and accumulation during vapor deposition.

Problems solved by technology

This organic layer is susceptible to moisture, so that it cannot be subjected to etching.

Method used

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  • Vapor deposition mask, vapor deposition method, and production method for organic el display device
  • Vapor deposition mask, vapor deposition method, and production method for organic el display device
  • Vapor deposition mask, vapor deposition method, and production method for organic el display device

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third embodiment

[0093]A method for manufacturing an organic EL display apparatus according to the present invention comprises: forming a TFT (not shown), a planarizing layer, and a first electrode 22 (for example, an anode) on a supporting substrate 21; overlapping the supporting substrate 21 and a vapor deposition mask 1 such that the first electrode 22 is oriented downward and aligning them; and, vapor depositing a vapor deposition material 51, wherein a deposition layer 25 of an organic layer is formed by using the previously-described vapor deposition method. In this way, a second electrode 26 (a cathode, for example) is formed on the deposition layer 25.

[0094]While the supporting substrate 21 such as a glass plate, for example, is not shown fully, a driving element such as a TFT is formed for a R, G, B sub-pixel of each pixel, and the first electrode 22 that is connected to the driving element is formed on the planarizing layer by a combination of an ITO layer and a layer of metal such as Ag o...

first embodiment

[0099](1) A vapor deposition mask according to the present invention comprises: a mask body at which an aperture pattern is formed; and a frame to which at least a part of a peripheral edge of the mask body is joined to hold the mask body at a certain state, wherein at least a part of the frame is formed by a columnar-shaped body in which unit structure bodies are stacked via a connecting end plate, each of the unit structure bodies comprising a core portion encompassing a vacant space therein and end plates provided on opposite end surfaces of at least a part of the core portion, thereby forming a sandwich structure.

[0100]The vapor deposition mask according to the first embodiment of the present invention can endure even a very large stress without buckling since a columnar-shaped body is formed by stacking unit structure bodies of a sandwich structure even in a case that a large stress acts in the axial direction of the frame while the frame of the vapor deposition mask is configu...

second embodiment

[0109](10) A method of vapor deposition according to the present invention comprises: arranging a substrate to be vapor deposited and the vapor deposition mask as described in one of (1) to (9) such that the substrate to be vapor deposited and the vapor deposition mask overlap each other; and, depositing a vapor deposition material onto the substrate to be vapor deposited by flying away the vapor deposition material from a vapor deposition source arranged at a distance from the vapor deposition mask.

[0110]In the vapor deposition method according to the second embodiment of the present invention, even when the mask body is bonded to a pair of opposing frames with tension being applied, the strength in the axial direction of a frame being sandwiched between the frames to which the mask body is bonded, is sufficiently large, so that the mask body is stably held. As a result, a high definition vapor deposition pattern is obtained in the vapor deposition.

[0111](11) The frame of the vapor...

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Abstract

Provided is a vapor deposition mask that suppresses heat conduction at a frame thereof, that achieves weight reduction, and that can tolerate high stress at a portion of the frame to which particularly high stress is applied. The present invention has: a mask main body (10) at which an opening pattern is formed; and a frame (15) to which at least a portion of a peripheral edge part of the mask main body is joined. At least a portion of the frame is formed as a rod-like lateral frame (15b) that is formed by laminating, via connection surface plates (153), unit structures (155) for a sandwich structure in which a surface plate (152) is stuck to a surface that faces at least portions of core parts (151) that contain vacant space.

Description

TECHNICAL FIELD[0001]The present invention relates to a vapor deposition mask, a vapor deposition method, and a method for manufacturing organic EL display apparatus that vapor deposits an organic layer of an organic EL display apparatus, for example.BACKGROUND ART[0002]When an organic EL display apparatus is manufactured, a driving element such as a TFT is formed on a substrate, on which an electrode of the TFT, an organic layer is deposited in correspondence for each pixel. This organic layer is susceptible to moisture, so that it cannot be subjected to etching. Therefore, as shown in FIG. 8, for example, deposition of an organic layer 80 is carried out by overlapping a vapor deposition mask 82 comprising a mask body 821 and a frame 822, and a substrate 81 to be vapor deposited, and vapor depositing an organic material 85a from a vapor deposition source 85 through an aperture 821c of the vapor deposition mask 82. Then, the organic layer 80 is deposited on an electrode 81a surround...

Claims

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Application Information

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Patent Type & Authority Applications(United States)
IPC IPC(8): C23C14/04H01L51/56H05B33/10
CPCC23C14/042H05B33/10H01L51/56H10K59/12H10K71/166H10K71/00
Inventor KISHIMOTO, KATSUHIKO
Owner SAKAI DISPLAY PROD
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