Coated solder spheres and method for producing the same

a technology of solder spheres and solder spheres, which is applied in the direction of soldering apparatus, sustainable manufacturing/processing, final product manufacturing, etc., can solve the problems of blackening of solder spheres, and achieve the effect of low slip properties and good slippag

Inactive Publication Date: 2015-06-02
SENJU METAL IND CO LTD
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Benefits of technology

[0014]Solder spheres consist of soft metals such as lead and tin, and hence their surfaces have low slip properties. Therefore, shaking, swinging, or vibrating of a large number of solder spheres in a container may cause those solder spheres which are in contact with the container wall or with one another to be rubbed without good slippage, thereby resulting in scraping of

Problems solved by technology

Therefore, shaking, swinging, or vibrating of a large number of solder spheres in a container may cause those solder spheres which are in contact with the container wall or with one another to be rubbed without good slippage, thereby resulting in scraping of the surfaces of the solder spheres, which causes blackeni

Method used

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  • Coated solder spheres and method for producing the same
  • Coated solder spheres and method for producing the same

Examples

Experimental program
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Effect test

example

[0030]Solder spheres of an Sn—Pb eutectic alloy having a diameter of 0.76 mm were dipped into a solution of stearamide (a fatty acid amidamide lubricant) dissolved in methylene chloride to give a concentration of 50 ppm, 500 ppm, or 1000 ppm. The solder spheres were collected by centrifugation and dried by volatilizing the solvent in a moisture controlled chamber, leaving solder spheres having a substantially uniform coating of stearamide on the surfaces thereof.

[0031]The resulting coated solder spheres and uncoated or bare solder spheres used as controls were subjected to a blackening test, a placement test, and a soldering test in the following manner.

Blackening Test

[0032]A 50 cc glass bottle was packed with 40 grams of the solder spheres to be tested. After the bottle was closed with a plastic cap, it was rotated at a rate of 60 rpm using a horizontal spindle holding the bottle in a vertical position until the number of revolutions reached a predetermined value. Thereafter, the l...

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PUM

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Abstract

Solder spheres which can avoid blackening during transportation have a substantially uniform coating of a lubricant on the surfaces thereof. They are produced by dipping freshly prepared solder spheres in a lubricant solution with a concentration of from 10 ppm to 1000 ppm followed by collection of the spheres and drying. The lubricant is preferably selected from an aliphatic hydrocarbon lubricant, a higher fatty alcohol or acid lubricant, a fatty acid amide lubricant, a metal soap lubricant, a fatty acid ester lubricant, a fluoroplastic lubricant, a silicone lubricant, and a combination thereof.

Description

BACKGROUND OF THE INVENTION[0001]The present invention relates to lubricant-coated solder spheres suitable for use in the formation of solder bumps on a substrate for connecting electronic components to the substrate. The invention also relates to a method for coating solder spheres with a lubricant.[0002]As electronic devices have become increasingly light, thin, short, or compact, electronic components used in these devices have been made compact and multi-functional. In order to produce a multi-functional electronic component, it is necessary to assemble a plurality of integrated circuits (IC's) in a single component and form a great number of leads extending from the IC's.[0003]Examples of such multi-functional electronic components include QFP's (Quad Flat Packages) and SOP's (Small Outline Packages), which have leads projecting from all four sides or from two opposing sides, respectively, of a square or rectangular body. These electronic components, however, are limited in the...

Claims

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Application Information

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IPC IPC(8): B32B5/16B23K35/365B05D1/18B22F1/02B23K35/02B23K35/14B23K35/26B23K35/36B23K35/40C10M105/00C10N50/02C10N50/08H01L21/60H05K3/34
CPCB23K35/0244B23K35/26B23K35/3612B23K35/3615B23K35/3618B23K35/365B23K2101/36H05K3/3436H05K2203/041H05K2203/122H05K2203/127Y10T428/2991Y10T428/2995Y02P70/50B05D1/18H05K2203/0195H05K2203/0485
Inventor SOHMA, DAISUKEROPPONGI, TAKAHIRO
Owner SENJU METAL IND CO LTD
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