Liquid photosensitive welding resistant printing ink and its circuit board
A solder resist ink, liquid technology, applied in the direction of ink, optics, optomechanical equipment, etc., can solve the problems of large curing shrinkage, insufficient ink flexibility, and the ink cannot take into account developability, photosensitivity and resistance to solder thermal shock, etc. Small curing shrinkage, good flexibility, balanced effect of solder thermal shock resistance
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Embodiment 1
[0026] First synthetic photosensitive alkali-soluble resin, adding methylol content in reactor is 200 grams of methylolation bisphenol A type epoxy resin (epoxy equivalent 220) of 13.5%, ethylene glycol butyl ether acetate 200g, 56g of terephthalic acid, 2g of N,N-dimethylbenzylamine, heated to 95-105°C for 15 hours, the acid value was determined to be less than 1, then added 0.5g of hydroquinone, 60g of acrylic acid, and reacted at 95-105°C After 10 hours, the acid value is less than 70, add 80 grams of dehydrating agent toluene, 0.5 grams of concentrated sulfuric acid, reflux dehydration, collect about 11.3 g of water, measure the acid value is less than 5, distill off toluene, add 100 grams of phthalic anhydride, React at 95-105° C. for 6 hours to obtain a resin solution (a) with an acid value of 60 and a solid content of 68%.
[0027] Then prepare the solder resist ink, get the above-mentioned synthetic photosensitive alkali-soluble resin solution (a) 100g, photoinitiator ...
Embodiment 2
[0030] Adding methylol content in reaction bottle is 200 grams of methylolation bisphenol A epoxy resins (epoxy equivalent 220) of 13.5%, ethylene glycol butyl ether acetate 200 grams, methylolation bisphenol A 86 grams (the methylol content is 12.5%), 2 grams of N,N-dimethylbenzylamine, heated to 95-105° C. for 15 hours, and the acid value was measured to be less than 1, then 0.5 g of hydroquinone and 60 g of acrylic acid were added, React at 95-105°C for 10 hours, the measured acid value is less than 68, add 80 grams of toluene, concentrated H 2 SO 4 1 gram, reflux dehydration, collect about 11.3g of water, measure the acid value to be less than 5, distill and remove toluene, add phthalic anhydride, react for 6 hours at 95-105 ° C, obtain an acid value of 63, and a solid content of 70% Resin (b) liquid.
[0031] The obtained resin solution (b) was used to replace the resin solution of the photosensitive resin composition (a) in Example 1, and the same method as in Example ...
Embodiment 3
[0033] Add (methylol content 13.5%) methylolated bisphenol A epoxy resin 200g (epoxy equivalent 220) in reactor, ethylene glycol butyl ether acetate 200g, succinic acid 42g, N, N - 2 grams of dimethylbenzylamine was heated to 90°-100°C for 15 hours, and the acid value was measured to be less than 1, then 0.5 g of hydroquinone and 60 g of acrylic acid were added, and reacted at 95°-105°C for 10 hours, and the acid value was measured to be less than 1 78, add 80 grams of toluene, concentrated H 2 SO 4 1 gram of reflux dehydration, collected about 11g of water, measured acid value is less than 5, distilled off toluene, added 95g of phthalic anhydride, reacted at 95°-105°C for 6 hours to obtain an acid value of 60, and a solid content of 68%. Resin (c) liquid.
[0034] The obtained resin solution (c) was substituted for the resin solution of the photosensitive resin composition (a) in Example 1, and the same method as in Example 1 was used to prepare a solder resist ink.
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