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Surface mounted polymer positive temperature coefficient self recovery fuse and its manufacturing method

A self-recovery fuse, positive temperature coefficient technology, applied in the direction of resistors with positive temperature coefficient, etc., can solve the problems of difficult to achieve product performance, large installation size, can not meet the installation density of electronic products, etc. The effect of improving temperature characteristics

Inactive Publication Date: 2008-04-16
深圳市长园维安电子有限公司
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

Traditional self-recovery fuses are all pin-type, and the required installation size is large. They can only be installed by soldering on the reverse side of the circuit board. Large, high-reliability electronic products adopt new reflow soldering process requirements
[0003] The reflow soldering process requires components with good heat resistance, and has special requirements on the appearance, structure and size of the components. Most of the existing components suitable for the reflow soldering process are surface-mounted. If it is simple to replace the existing The thermistor is made into a sheet, which not only has poor temperature resistance, but also cannot meet the process requirements, and the product performance is difficult to achieve

Method used

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  • Surface mounted polymer positive temperature coefficient self recovery fuse and its manufacturing method
  • Surface mounted polymer positive temperature coefficient self recovery fuse and its manufacturing method
  • Surface mounted polymer positive temperature coefficient self recovery fuse and its manufacturing method

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Embodiment Construction

[0025] Below in conjunction with accompanying drawing and embodiment the present invention will be described in further detail:

[0026] A surface-mounted polymer positive temperature coefficient resettable fuse, including a chip substrate 1 made of a sheet-shaped conductive polymer with positive temperature coefficient characteristics and an electrode foil 6 mounted on the surface of the chip substrate 1;

[0027] The mix that makes up the chip substrate includes:

[0028] Two kinds of high-density powdered polyethylene with a melt index of 0.02-1.5 and 1.2-4.0 at a weight ratio of 1:5-1:10, using these two powdered polyethylenes, the molecular chain structure is optimized, and the flow resistance Characteristics and temperature resistance can be improved accordingly;

[0029] Conductive carbon black and N series carbon black with a weight ratio of 1:99-50:50. The more the content of these two carbon blacks in the mixture, the smaller the resistivity. However, the mixing is ...

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Abstract

A surface adhesive polymer thermotropic coefficient self-resetting fuse and its manufacturing method includes a chip body made of sheet conductive polymer with thermotropic coefficient character and a sheet electrode on its surface. The conductive polymer includes two kinds of high density powder polythenes of 1:5-1:10 weight ratio and 0.02-1.5, 1.2-4.0 in fusion factor, conductive black carbon with weight ratio: 1:99-50:50 and fillers made up of N serial black carbon: Mg(OH)2 AlOH, SiO2 and TiO2, improving its current, temperature resistance performance, and its mechanical structure.

Description

technical field [0001] The invention relates to an electrical component, in particular to a resettable fuse with a positive temperature coefficient (Positive Temperature Coefficient, PTC for short) and a manufacturing method thereof. Background technique [0002] A thermistor with a positive temperature coefficient (Positive Temperature Coefficient, referred to as PTC) is often used as an overcurrent protection element, also known as a resettable fuse. Traditional self-recovery fuses are all pin-type, and the required installation size is large. They can only be installed by soldering on the reverse side of the circuit board. Large, high-reliability electronic products adopt new reflow soldering process requirements. [0003] The reflow soldering process requires components with good heat resistance, and has special requirements on the appearance, structure and size of the components. Most of the existing components suitable for the reflow soldering process are surface-moun...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): H01C7/02
Inventor 汪润田孙晗龙黄光晴徐义南李习斌
Owner 深圳市长园维安电子有限公司