Low temperature co-fired soft magnetic ferrite powder for laminated chip power inductor and preparation method thereof

Abstract

Low-temperature co-fired soft magnetic ferrite powder for laminated chip power inductors and a preparation method thereof, the formula includes a base material and additives, wherein the base material, by mass ratio, Fe 2 o 3 50.0-70.0%, NiO 5.0-15.0%, ZnO 15-30.0%, CuO 3.84-9.40%; additives, based on the total mass of the base material, Bi 2 o 3 1.0-6.0%, frit powder 0.5-6.0%; among them, the formula of frit is calculated by mass ratio, alumina 9-12%, silicon dioxide 62-65%, calcium oxide 5-8%, magnesium oxide 0.5% ‑1.0%, potassium oxide 2.0‑4.0%, sodium oxide 1.0‑2.0%, boron oxide 8.0‑10.0%. Adding deionized water to the base material, stirring, mixing, drying, pre-burning, adding additives, adding deionized water, mixing, drying and pulverizing. The magnetic permeability of the powder decreases with the addition of additives, and the anti-DC bias performance is good.

Description

technical field [0001] The invention relates to ferrite powder, in particular to low-temperature co-fired soft ferrite powder for laminated chip power inductors and a preparation method thereof. Background technique [0002] Multilayer chip ferrite inductors are widely used in mobile communications, computers, automotive electronics, television, broadcasting satellites and other fields due to their small size, low cost, excellent shielding performance, high reliability, and easy surface mount mounting. widely used. In recent years, with the transmission of large amounts of data and the improvement of processing speed of electronic products, the power demand for chip inductors is also increasing. Small size and high power requirements. Especially in modern circuit systems, more and more electronic devices such as inductors, converters, magnetic beads, transformers, etc. work under low-voltage and high-current conditions. big impact. At the same time, in some special pract...

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Problems solved by technology

Although wire wound chip inductors have a high withstand current value, they are large in size, low in production efficiency, and high in cost

[0005] The rated current of a multilayer chip inductor is mainly determined by the thickness of the silver coil inside the inductor, that is, the greater the amount of silver used, the smaller the DC resistance RDC of the coil, and the higher the rated current of the inductor; but blindly increasing The content of silver brings the problem of co-firing matching between the silver layer and the ferrite: there is a gap between the magnet and the silver layer, and the magnet cracks; The high current resistance characteristics of the material can increase the rated current of the device, reduce the amount of silver, and ensure the matched co-firing of silver and magnets

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