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Surface mounted polymer positive temperature coefficient self recovery fuse and its manufacture

A self-recovery fuse, positive temperature coefficient technology, applied in the direction of resistors with positive temperature coefficient, can solve the problems of difficult to achieve product performance, large installation size, can not meet the installation density of electronic products, etc. The effect of improving temperature characteristics

Inactive Publication Date: 2004-04-28
深圳市长园维安电子有限公司
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

Traditional self-recovery fuses are all pin-type, and the required installation size is large. They can only be installed by soldering on the reverse side of the circuit board. Large, high-reliability electronic products adopt new reflow soldering process requirements
[0003] The reflow soldering process requires components with good heat resistance, and has special requirements on the appearance, structure and size of the components. Most of the existing components suitable for the reflow soldering process are surface-mounted. If it is simple to replace the existing The thermistor is made into a sheet, which not only has poor temperature resistance, but also cannot meet the process requirements, and the product performance is difficult to achieve

Method used

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  • Surface mounted polymer positive temperature coefficient self recovery fuse and its manufacture
  • Surface mounted polymer positive temperature coefficient self recovery fuse and its manufacture
  • Surface mounted polymer positive temperature coefficient self recovery fuse and its manufacture

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Embodiment Construction

[0025] Below in conjunction with accompanying drawing and embodiment, the present invention is described in further detail:

[0026] A surface-mounted polymer positive temperature coefficient resettable fuse, comprising a chip substrate 1 made of a conductive polymer with positive temperature coefficient characteristics and an electrode foil 6 mounted on the surface of the chip substrate 1;

[0027] The mixture to make the chip matrix includes:

[0028] Two kinds of high-density powdered polyethylene with melt index of 0.02-1.5 and 1.2-4.0 with a weight ratio of 1:5-1:10, respectively, using these two powdered polyethylene, the molecular chain structure is optimized, flow resistance Characteristics and temperature resistance characteristics can be improved accordingly;

[0029] Conductive carbon black and N-series carbon black with a weight ratio of 1:99-50:50, the more carbon black, the lower the resistivity, but the mixing is not easy, the process performance is worse, it i...

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Abstract

A surface adhesive polymer thermotropic coefficient self-resetting fuse and its manufacturing method includes a chip body made of sheet conductive polymer with thermotropic coefficient character and a sheet electrode on its surface. The conductive polymer includes two kinds of high density powder polythenes of 1:5-1:10 weight ratio and 0.02-1.5, 1.2-4.0 in fusion factor, conductive black carbon with weight ratio: 1:99-50:50 and fillers made up of N serial black carbon: Mg(OH)2 AlOH, SiO2 and TiO2, improving its current, temperature resistance performance, and its mechanical structure.

Description

technical field [0001] The invention relates to an electrical component, in particular to a self-recovery fuse with a positive temperature coefficient (Positive Temperature Coefficient, PTC for short) and a manufacturing method thereof. Background technique [0002] A thermistor with a positive temperature coefficient (PTC) is often used as an overcurrent protection element, also known as a resettable fuse. The traditional resettable fuses are of pin type, and the required installation size is large. They can only be installed by soldering on the reverse side of the circuit board, which neither meets the requirements of the existing circuit miniaturization, nor can it meet the requirements of high installation density and production volume. Large, high-reliability electronic products are required by the new reflow soldering process. [0003] The reflow soldering process requires the components to have good heat resistance, and has special requirements for the external struc...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): H01C7/02
Inventor 汪润田孙晗龙黄光晴徐义南李习斌
Owner 深圳市长园维安电子有限公司