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Method for preparing nano copper oxide on surface of SiO2

A nano-copper oxide and compound technology, applied in liquid chemical plating, metal material coating process, coating, etc., can solve the problems of high energy consumption, complicated process, serious agglomeration, etc., and achieve large specific surface area, uniform distribution, The effect of high product purity

Inactive Publication Date: 2008-04-30
ZHEJIANG UNIV
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

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Problems solved by technology

[0004] These methods often have the disadvantages of severe agglomeration, high energy consumption, and complicated process. At the same time, these methods do not directly prepare copper oxide on the existing carrier, and require subsequent composite processes.

Method used

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  • Method for preparing nano copper oxide on surface of SiO2
  • Method for preparing nano copper oxide on surface of SiO2

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0015] Dissolve NaOH in ethanol to prepare a solution with a concentration of 0.008g / ml. Add 200ml of absolute ethanol and 1.0ml of water into a three-neck flask, add 0.5g of SiO 2 , stirred into a uniform suspension in a constant temperature water bath at 25°C. Add 0.6g of copper acetate and stir at constant temperature for 6hr. Under the condition of stirring, 15ml NaOH ethanol solution was added dropwise into the three-necked flask at a rate of 1ml / min, and the stirring was continued for 10hr, and then a solid precipitate was obtained by centrifugation. After washing with ethanol several times, the product was obtained by drying. figure 1 is the sample X-ray diffraction pattern, calculated according to the Scherrer formula, its average particle diameter is 10nm. figure 2 It is an electron microscope photo of the product. It can be seen from the picture that CuO particles are well dispersed on the surface of the network silica gel.

Embodiment 2

[0017] Dissolve NaOH in methanol to prepare a solution with a concentration of 0.008g / ml. Add 200ml of anhydrous methanol and 1.0ml of water into a three-neck flask, add 0.5g of SiO 2 , stirred into a uniform suspension in a constant temperature water bath at 40°C. Add 0.6g Cu(NO 3 ) 2 , stirring at constant temperature for 6hr. Under stirring conditions, 15ml NaOH methanol solution was added dropwise into the three-necked flask at a rate of 1ml / min, and after stirring for 2hrs, a solid precipitate was obtained by centrifugation. After washing with ethanol several times, the product was obtained by drying. According to X-ray diffraction analysis, according to Scherrer formula calculation, it can be seen that the average particle diameter is 8nm.

Embodiment 3

[0019] Dissolve NaOH in isopropanol to prepare a solution with a concentration of 0.001 g / ml. Add 200ml of anhydrous isopropanol and 2ml of water into a three-neck flask, add 0.5g of SiO 2 , stirred into a homogeneous suspension in a constant temperature water bath at -5°C. Add 0.01g CuCl 2 , stirring at constant temperature for 48hr. Under stirring conditions, 40ml of NaOH isopropanol solution was added dropwise into the three-necked flask at a rate of 1ml / min, and after stirring for 2hr, solid precipitation was obtained by centrifugation. After washing with ethanol several times, the product was obtained by drying. According to X-ray diffraction analysis, according to Scherrer formula calculation, it can be seen that the average particle diameter is 6nm.

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Abstract

The invention discloses a method to make nm copper oxide on the surface of SiO2 that includes the following steps: making low class alcohol solution that the volume fraction is 0.1%-20%, adding 0.1-25g SiO2 and 0.005-10g Cu compounding per 100ml low class solution while whisking, and mixing equally; making water solution or alcoholic solution of inorganic base that the concentration is 1-300g / L, adding to the reaction system made from previous step, reacting for 10min-10hr, and the temperature is 5-70 degree centigrade, taking centrifugal separation, drying to gain the compounding material. The invention effectively avoids or reduces aggregation phenomenon of CuO particle.

Description

technical field [0001] The present invention relates to SiO 2 The invention discloses a method for preparing nanometer copper oxide on the surface, which belongs to the field of preparation of nanocomposite materials. Background technique [0002] Copper oxide is a versatile material that has been used in catalysts, superconducting materials, thermoelectric materials, sensing materials, glass, ceramics and other fields. In addition, copper oxide can also be used as a burning rate catalyst for rocket propellants. It can not only significantly increase the burning rate of homogeneous propellants and reduce the pressure index, but also has a good catalytic effect on AP composite propellants. A large number of experiments have shown that the application effect of copper oxide has a great relationship with its particle size, and the smaller the particle size, the better the application effect. Therefore, the preparation of nano-copper oxide has become one of the hotspots in the...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): C23C18/02C23C18/12
Inventor 蒋新
Owner ZHEJIANG UNIV