Electronic component-use substrate and electronic component

A technology for electronic components and substrates, applied in circuit substrate materials, printed circuit components, components of fixed capacitors, etc., and can solve problems such as unresearched
CN100409384CInactive Publication Date: 2008-08-06TDK CORPARATION
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Patent Information

Authority / Receiving Office
CN · China
Patent Type
Patents(China)
Current Assignee / Owner
TDK CORPARATION
Publication Date
2008-08-06
Estimated Expiration
Not applicable · inactive patent

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Abstract

An object of the invention is to provide a substrate for an electronic part and an electronic part which have higher dielectric constant compared to conventional materials, which do not suffer from reduced strength, and which enjoy the advantages of small size, excellent performance and improved overall electrical characteristics; a substrate for an electronic part wherein the material used for the production exhibits reduced lot-to-lot variation in the electric properties, and in particular, in the dielectric constant, and wherein wearing of the mold in the production of the material has been suppressed; and an electronic part and an electronic part which have a high withstand voltage. In order to attain such object, the substrate for an electronic part and the electronic part are constituted to comprise a composite dielectric material wherein at least a dielectric material having a circular, oblate circular or oval projection shape is dispersed in a resin.
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Description

technical field

[0001] The present invention relates to an electronic component and an integrated circuit using a prepreg and a substrate, especially an electronic component using a prepreg and a substrate having an excellent dielectric constant, which are very suitable for use in a high frequency region (above 100 MHz). Background technique

[0002] In recent years, assembly methods in the fields of communication, civil, and industrial electronic instruments have developed significantly in the direction of miniaturization and high density. Accordingly, materials are required to have better heat resistance, dimensional stability, and electrical properties. and formability etc.

[0003] As high-frequency electronic components or high-frequency multilayer substrates, sintered ferrite or sintered ceramics are usually multilayered and formed on the substrate. Forming these materials into a multilayer substrate has the advantage of enabling miniaturization, so it has been freque...

Claims

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