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Electronic component-use substrate and electronic component

A technology for electronic components and substrates, applied in circuit substrate materials, printed circuit components, components of fixed capacitors, etc., and can solve problems such as unresearched

Inactive Publication Date: 2008-08-06
TDK CORPARATION
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

However, what these documents disclose is only ferrite magnetic powder, and no research has been carried out on other materials or magnetic powder and other materials.

Method used

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  • Electronic component-use substrate and electronic component
  • Electronic component-use substrate and electronic component
  • Electronic component-use substrate and electronic component

Examples

Experimental program
Comparison scheme
Effect test

experiment example 1

[0178] As the resin material, the materials shown in Table 1-1 and 1-2 were prepared, and the mixed materials obtained by mixing the dielectric material powder and magnetic material powder shown in Table 1-1 and 1-2 in the specified ratio were measured respectively. Dielectric constant ε. The results are shown in Tables 1-1 and 1-2. In addition, the decrease in the dielectric constant when the magnetic material is contained is shown in the table together with the comparative sample. In Table 1-1, a conventional comparative sample with a dielectric material powder content of 50 vol %, and a dielectric material powder content of 60 vol % represent a sample of the present invention. In addition, in Table 1-1, in (ε×μ) 1 / 2 In the calculation of , since the magnetic material powder is not included, μ=1 is used for calculation.

[0179]

[0180]

[0181] As can be seen from Tables 1-1 and 1-2, the maximum content of the dielectric material powder and magnetic material powde...

Embodiment 1

[0183] figure 1 with figure 2 is a diagram showing an inductor as Embodiment 1 of the present invention, figure 1 represents a perspective oblique view, figure 2 Represents a cutaway view.

[0184] In the figure, an inductor 10 includes structural layers (prepreg to substrate) 10a to 10e having the resin of the present invention, internal conductors (coil patterns) 13 formed on process structural layers 10b to 10e, and a coil pattern for the internal conductors. 13 through-holes 14 for electrical connections. The pillar through hole 14 can be formed by drilling, laser processing, etching, or the like. In addition, the terminal wiring of the formed coil is connected to the through-pillar 12 formed on the end surface of the inductor 10 and the terminal pattern 11 formed on the upper and lower sides thereof. The through-pillar 12 is a structure cut in half by cutting, V-cutting, or the like. This is formed by forming a plurality of elements on a collective substrate and c...

Embodiment 2

[0189] image 3 with Figure 4 is a diagram showing an inductor as Embodiment 2 of the present invention, image 3 represents a perspective oblique view, Figure 4 Represents a cutaway view.

[0190] In this embodiment, the pattern of the coil wound in the vertical direction in Embodiment 1 is represented as a structural form of a helical coil wound in the lateral direction. The other structural elements are the same as those in Embodiment 1, and the same symbols are assigned to the same structural elements, and description thereof will be omitted.

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PUM

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Abstract

An object of the invention is to provide a substrate for an electronic part and an electronic part which have higher dielectric constant compared to conventional materials, which do not suffer from reduced strength, and which enjoy the advantages of small size, excellent performance and improved overall electrical characteristics; a substrate for an electronic part wherein the material used for the production exhibits reduced lot-to-lot variation in the electric properties, and in particular, in the dielectric constant, and wherein wearing of the mold in the production of the material has been suppressed; and an electronic part and an electronic part which have a high withstand voltage. In order to attain such object, the substrate for an electronic part and the electronic part are constituted to comprise a composite dielectric material wherein at least a dielectric material having a circular, oblate circular or oval projection shape is dispersed in a resin.

Description

technical field [0001] The present invention relates to an electronic component and an integrated circuit using a prepreg and a substrate, especially an electronic component using a prepreg and a substrate having an excellent dielectric constant, which are very suitable for use in a high frequency region (above 100 MHz). Background technique [0002] In recent years, assembly methods in the fields of communication, civil, and industrial electronic instruments have developed significantly in the direction of miniaturization and high density. Accordingly, materials are required to have better heat resistance, dimensional stability, and electrical properties. and formability etc. [0003] As high-frequency electronic components or high-frequency multilayer substrates, sintered ferrite or sintered ceramics are usually multilayered and formed on the substrate. Forming these materials into a multilayer substrate has the advantage of enabling miniaturization, so it has been freque...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): H01G4/20H01B3/00H01F5/06H01F17/00H01F19/06H01F27/00H01F27/32H01F41/04H01G4/40H01P1/203H01P5/10H01P5/18H01P7/10H01Q1/38H03B5/18H03H7/01H03H7/075H05K1/03H05K1/16H05K3/46
CPCH01F41/046H01F27/327H01P5/187H01G4/40H05K2201/086H05K1/165H01F2017/0026H01F17/0006H01F17/0013H03F1/22H05K1/0373H05K2201/0209H03H2001/0085H05K1/162H01P5/10H05K1/0366H03H7/1725H03H7/0115H01Q1/38H01P1/20345H01F5/06H01P5/185
Inventor 高谷稔远藤敏一
Owner TDK CORPARATION
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