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Laser perforating method and its perforating device

A laser drilling and laser technology, used in lasers, laser welding equipment, laser parts and other directions, can solve the problems of micro-crack heat affected area, poor quality of large holes, inability to drill large holes, etc. High-grade, clean surface effect

Inactive Publication Date: 2008-12-10
SHANXI FEIHONG LASER TECH
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0004] The purpose of the present invention is to propose a laser drilling method using free laser pulses and modulated laser pulses and a drilling device designed to realize the method; The technical problem of poor quality of the large holes drilled solves the technical problems of recasting layer and micro-cracks and large heat-affected area in laser drilling

Method used

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  • Laser perforating method and its perforating device
  • Laser perforating method and its perforating device
  • Laser perforating method and its perforating device

Examples

Experimental program
Comparison scheme
Effect test

Embodiment approach 1

[0042] If a small hole with a diameter of 1mm is drilled on a 0.7mm thick galvanized steel plate, firstly, use the CCD to position the hole according to the workpiece needs, and adjust the position of the focusing lens. Adjust the input parameters of the laser, control the output power, and output laser pulses with an energy of 0.3J. Output high peak power 1.0×10 under oxygen protection 9 W / cm 2 The modulated laser pulse penetrates the workpiece with one pulse, and a small hole D with a diameter of 80 μm is obtained. 1 . Then readjust the frequency, pulse width, and input power of the laser, so that the output laser energy is a free-running laser pulse of 2J, and the positions of the focusing lens and the workpiece remain unchanged. Under the protection of the auxiliary gas, the hole is drilled to obtain an aperture of 0.7 mm hole D 2 . Finally, output the modulated laser pulse with an energy of 0.3J, use the motor to control the X, Y axis 45-degree total reflection mirro...

Embodiment 2

[0044] If a small hole with a diameter of 2mm is drilled on a low carbon steel with a thickness of 1.5mm, first of all, according to the position of the workpiece to be drilled, use the CCD to position and adjust the position of the focusing lens. Adjust the input parameters of the laser, control the output power, and output laser pulses with an energy of 2J. Output high peak power 3×10 under argon protection 9 W / cm 2 One pulse of the modulated laser pulse penetrates the workpiece to obtain a small hole D1 with a diameter of 100 μm. Then readjust the frequency, pulse width, and input power of the laser, so that the output laser energy is a free-running laser pulse of 16J, and the position of the focusing lens and the workpiece remains unchanged. Under the protection of the auxiliary gas, the hole is drilled to obtain an aperture of 1.4 mm hole D 2 . Finally, output the modulated laser pulse with an energy of 1J, and use the servo motor to control the X-axis and Y-axis 45-d...

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Abstract

The invention discloses a laser drilling method and a drilling device thereof. The workpiece is kept still, and a small hole D1 is processed first, and then a hole D2 with a diameter of (2 / 5)D3 to (3 / 4)D3 is processed. Finally, the required hole D3 is obtained by rotary cutting. The device includes interconnected lasers and their optical light guide parts, laser focusing mirror parts, etc.; from top to bottom, the laser focusing mirror parts are mainly X-axis, Y-axis 45-degree full reflection mirrors, upper rail frame, X-axis moving frame, middle Rail frame, Y-axis moving frame, focusing lens; X-axis moving frame can slide relatively along the X-axis of the upper rail frame, and Y-axis moving frame can relatively slide along the Y-axis of the middle rail frame. The hole diameter D3 suitable for drilling in the present invention is 0.5 mm to 2 mm, and the processing quality is high.

Description

technical field [0001] The invention relates to a method for high-quality microhole processing by combining free laser pulses and modulated laser pulses and a device designed according to the method, belonging to the technical field of laser processing. Background technique [0002] Compared with other drilling methods, laser drilling has the advantages of flexible processing, low cost, fast processing speed, high efficiency, no contact, transmission in the air, high drilling depth-to-diameter ratio, processing any material, and environmental protection. It is widely used in drilling ceramics and composite materials, and can also drill holes with a series of diameters and a certain inclination angle in superhard and high-temperature alloy materials, such as the drilling of aircraft engine turbine blades. [0003] At present, laser drilling methods mainly include replication method and rotary method. The replication method also includes single-pulse drilling and multi-pulse ...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): B23K26/36B23K26/42B23K26/14B23K26/04B23K26/06H01S3/10B23K26/046B23K26/382B23K26/70
Inventor 王智勇左铁钏辛凤兰刘学胜张东明
Owner SHANXI FEIHONG LASER TECH
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