Method for ingelligent optimizing procedure of semiconductor packing producing line

An intelligent optimization and semiconductor technology, applied in semiconductor/solid-state device manufacturing, instrumentation, adaptive control, etc., can solve problems such as complex and variable production systems, and few simulation studies on semiconductor packaging production lines, achieving fast convergence and machine average The effect of reasonable occupancy rate and simple structure

Inactive Publication Date: 2009-03-11
TONGJI UNIV
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AI Technical Summary

Problems solved by technology

However, due to the influence of many realistic factors such as the complexity and variability of the entire production system and the coupling of various product processing processes, there are still few researches on the optimization and simulation of semiconductor packaging production lines at home and abroad.

Method used

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  • Method for ingelligent optimizing procedure of semiconductor packing producing line
  • Method for ingelligent optimizing procedure of semiconductor packing producing line
  • Method for ingelligent optimizing procedure of semiconductor packing producing line

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Embodiment Construction

[0042] The present invention carries out the particle swarm optimization algorithm solution principle adopted in subproblem optimization solution is (referring to accompanying drawing 1):

[0043] The initial population is composed of randomly generated solutions, and the individuals in the population are called particles. The particles fly at a certain speed in the search space, and the speed can be dynamically adjusted according to the flying experience of itself and its companions. Assuming that the size of particle swarm is N, the coordinate position of particle i (i=1-N) in D, dimensional space can be expressed as x i =(x i1 , x i2 ,K,x id , KxiD ), the velocity of particle i is defined as the distance traveled by the particle in each iteration, with v i =(v i1 , v i2 ,K,v id , Kv iD )express. The flight velocity v of particle i in the dth (d=1-D) dimensional subspace id And the position updates of the particles are adjusted according to the following two equatio...

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Abstract

The invention provides an intelligent method for optimizing working procedure of a semiconductor packaging production line, applying particle swarm optimization (PSO) to optimize the working procedure in a semiconductor packaging process, modeling and finding the solution, taking processing center as a unit, building a mapping relation between problem to be solved and particle swarm, using particles to express optional solutions to the problem, and finding the optimized solution under the guidance of corresponding target; each particle swarm optimization subproblem is using processing time of the machine on the production line for different products to encode the particles to determine particle swarm optimization space and making time sequence decoupling on the optimization problem to be solved, obtaining the corresponding subproblem and then dividing the problem space and determining a mapping relation between the divided space and each subproblem to find particle swarm optimization solution of each subproblem, thus obtaining an optimized machine processing time allocating solution and machine occupation ratio. The practice indicates that PSO has the advantages simple concept, convenient implementation, rapid convergence, etc.

Description

technical field [0001] The invention relates to an intelligent optimization method for a semiconductor packaging production line process, belonging to the technical field of semiconductor manufacturing. Background technique [0002] With the development of information technology and electronic technology, the semiconductor manufacturing industry has rapidly become a very important industry, occupying an increasingly important position in the national economy. Due to the huge investment, complex manufacturing process, and extremely fast update of products and equipment, the control and optimization of its manufacturing process is very important. Semiconductor manufacturing is considered to be one of the most complex manufacturing processes today, with the characteristics of reentrancy, high uncertainty, high complexity, and multi-objective optimization. Its control and optimization issues have received extensive attention. [0003] Generally, the semiconductor production pro...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): G05B13/00G05B13/02G05B13/04H01L21/00H01L21/02
Inventor 汪镭康琦吴启迪
Owner TONGJI UNIV
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