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Nano-level high depth-width-ratio structure and manufacturing method thereof

A manufacturing method and aspect ratio technology, applied in the field of microstructure, can solve problems such as inability to batch manufacture, limited aspect ratio, and small line width of manufacturing patterns

Inactive Publication Date: 2009-04-08
IND TECH RES INST
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

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Problems solved by technology

[0009] Although this method has the advantages of small pattern line width and short production time, the obtained aspect ratio is still limited and cannot be mass-produced
[0010] The above-mentioned existing microstructure manufacturing methods are mainly used for micron-scale mold processing, but when people want to produce higher aspect ratios or nano-scale microstructures, these methods cannot be achieved.

Method used

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  • Nano-level high depth-width-ratio structure and manufacturing method thereof
  • Nano-level high depth-width-ratio structure and manufacturing method thereof
  • Nano-level high depth-width-ratio structure and manufacturing method thereof

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Embodiment Construction

[0019] The present invention mainly utilizes chemical method from bottom to top (Bottom up), takes atom or molecule as the most basic unit, and cooperates with electrolysis, chemical vapor deposition and other methods to gradually grow into nano-sized materials. Based on this concept, the nanotubes produced by chemical methods can achieve extremely high aspect ratios and extremely small-sized structures, coupled with the defined initial layer pattern, combined with micro-electroplating molding, the obtained results can be obtained. The required microstructure with high hardness and ultra-high aspect ratio. Commonly used materials for the aforementioned nanotubes include the following: carbon nanotubes (Carbon nanotube), gallium nitride (GaN) nanotubes, boron nitride nanotubes, and nanotube compound.

[0020] In the following, carbon nanotubes will be cited as a preferred embodiment of the present invention, and the use method, operation mode, efficacy, and other technical feat...

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Abstract

The nanometer level superhigh depth / width ratio structure has the preparation process including the following steps: preparing one substrate; sputtering or chemical vapor deposition to form one conducting layer and one catalyst pattern layer successively on the substrate; forming one nanometer tube layer in certain height on the catalyst defined areas; electroplating with the exposed conducting layer area without nanometer tube layer as one reaction electrode; and eliminating the nanometer tube layer and substrate to obtain the micro structure with superhigh depth / width ratio.

Description

technical field [0001] The present invention relates to a nanoscale ultra-high aspect ratio structure and its manufacturing method, especially to a structure that uses chemical methods to produce nanotubes to achieve extremely high aspect ratio and extremely small size, plus the defined catalyst Layer patterning combined with micro-plating to obtain a microstructure with characteristics such as high hardness, ultra-high aspect ratio and extremely small line width. Background technique [0002] With the advancement of technology, miniaturization is the trend of the MEMS industry, but it must be able to be produced in large quantities to reduce the manufacturing cost of miniaturized component products, thus deriving "microsystem technology" that meets the needs of modern industries. Many industries, including optoelectronics, communications, and biomedicine, all require micro-components and structures manufactured by micro-system technology. Therefore, as the application indus...

Claims

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Application Information

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IPC IPC(8): B82B3/00B82B1/00
Inventor 王郁仁沈圣智林坤龙李聪瑞蔡明杰周敏杰
Owner IND TECH RES INST