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Layered nano silicon oxide sheet modified polyamic acid resin composition and polyimide film prepared from the same

A technology of polyamic acid resin and polyimide film, which is applied in the field of polyimide film, can solve the problems of polyimide film transparency reduction, unfavorable alignment and punching processing procedures, etc., and achieve improved dimensional stability , solve the effect of difficult alignment and low water absorption

Active Publication Date: 2009-05-27
CHANG CHUN PLASTICS CO LTD
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

However, to achieve the dimensional stability required by the electronics industry, it is necessary to add a large amount of inorganic fillers, which will reduce the transparency of the prepared polyimide film, which is not conducive to the alignment and punching of these films in the subsequent processing. program

Method used

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Examples

Experimental program
Comparison scheme
Effect test

preparation example Construction

[0019] The polyamic acid resin composition of the present invention can be prepared by dissolving or dispersing the polyamic acid and the nano-layered silica sheet and / or nano-silica powder as a filler in a solvent and mixing them in a separate solution state. , or directly mix polyamic acid with nano-layered silicon oxide sheets and / or nano-silica powder as a filler, then disperse and / or dissolve with a solvent, and then fully mix with a high-speed mixer And get.

[0020] By using the polyamic acid resin composition of the present invention, the nano-layered silicon oxide sheet and / or nano-silica powder added therein as a filler is only added in an amount of 0.3 to 15% by weight, that is, A polyimide film with good dimensional stability, low water absorption, high transparency and low coefficient of thermal expansion (CTE) can be obtained from the polyamic acid composition, and it can be applied to circuits of flexible printed circuit boards and liquid crystal displays plate...

Embodiment 1

[0026] (a) Synthesis of polyamic acid

[0027] Take 0.864 grams (0.008 moles) of p-phenylenediamine (PDA), 6.4 grams (0.032 moles) of 4,4'-oxydiphenylamine (ODA) and 60 grams of N-methylpyrrolidone (NMP) into with stirrer and N 2 After initial dissolution in the four-neck reaction flask of the conduit, blow in N 2 , after fully stirring and dissolving, the reaction temperature was maintained at 25°C.

[0028] Then feed 5.152 grams (0.016 moles) of benzophenone-3,3',4,4'-tetracarboxylic dianhydride (BTDA) and 25.0 grams of NMP into the reaction mixture, and continuously introduce N 2 The reaction was continued for another 1 hour. Then, continue to import N 2 Next, feed 2.352 grams (0.008 moles) of 4,4-diphthalic dianhydride (BPDA) and 10.0 grams of NMP to react for another 1 hour, and finally feed 3.488 grams (0.016 moles) of pyromellitic dianhydride (PMDA) ) and 20.0 g of NMP at 25°C and N 2 The reaction was carried out for 4 hours to obtain a polyamic acid resin solutio...

Embodiment 2-6

[0036] As in the method described in Example 1, a polyimide film was prepared according to the composition listed in Table 1 below.

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PUM

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Abstract

The invention discloses a polyamic acid resin component, which contains layered nanometer silica and or nanometer powder to prepare polyimide film with modified size safety, low hydroscopicity, high transparent property and low thermal bulking coefficient (CTE) for flexible printing circuit board and LED circuit board.

Description

technical field [0001] The present invention relates to a polyamic acid resin composition comprising layered nano-silicon chips and / or nano-powders and a polyimide film prepared from the polyamic acid resin composition. Background technique [0002] With the development of the electronic industry and technology, the demand for printed circuit wiring boards for mounting electronic components such as IC (Integrated Circuit) and LSI (Large-Scale Integrated Circuit) has increased rapidly. However, recent electronic equipment such as mobile phones Miniaturization, light weight, high functionality, high reliability, and low price are expected for electronic equipment. [0003] In order to achieve characteristics such as miniaturization and weight reduction of electronic equipment, as a method of mounting these electronic components, film carrier tapes for electronic component mounting such as TAB (Tape Automatic Bonding) are used to mount the device. These film carrier tapes for ...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): C08L77/00C08L79/08C08J5/18C08K3/36
Inventor 黄坤源杜安邦巫胜彦黄裕霖
Owner CHANG CHUN PLASTICS CO LTD
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