Low-thermal-expansion-coefficient insulating adhesive film and preparation method thereof

Abstract

The invention belongs to the technical field of novel electronic packaging materials, and discloses a low-thermal-expansion-coefficient insulating adhesive film and a preparation method thereof. The insulating adhesive film material is composed of three layers of structures and comprises an insulating polymer compound layer, a film supporting layer at the bottom of the insulating polymer compound layer and a protective film covering the surface of the insulating polymer compound layer, and the insulating polymer layer is made of insulating polymer electronic paste. The insulating polymer electronic paste comprises polymer resin, a curing agent, a curing accelerator, an inorganic filler, an auxiliary agent and a solvent, wherein the content of the inorganic filler in the insulating polymer electronic paste is 40-82% of the total mass of solvent-free solids in the insulating polymer electronic paste. The coefficient of thermal expansion of the cured insulating polymer compound is as low as 20 ppm / K, and the insulating polymer compound can be applied to semiconductor electronic packaging of printed circuit boards (PCB), substrates, carrier plates and the like so that manufacturing of fine electronic circuits is realized.

Description

technical field [0001] The invention belongs to the technical field of new electronic packaging materials. More specifically, the invention relates to an insulating adhesive film material used in semiconductor system-level electronic packaging, specifically an insulating adhesive film with a low thermal expansion coefficient and a preparation method thereof. Background technique [0002] With the development of electronic information technology, especially various electronic products such as wearable electronic devices, smart phones, and ultra-thin computers, they are constantly developing in the direction of high-frequency, high-speed, light, thin, short, and multi-functional system integration. High frequency and high speed require materials to have low dielectric constant and dielectric loss; light and thin, miniaturized materials require good thermal stability and small structural deformation, that is, small thermal expansion coefficient. Generally, insulating dielectric...

AI Technical Summary

Problems solved by technology

Since the thermal expansion coefficient of polymer materials is significantly higher than that of the metal components and packaged devices that are in contact with it, the degree of expansion of various materials is different when heated, resulting in the mismatch of thermal expansion coefficients, and the resulting thermal residual stress may cause devices to age and crack. Poor thermal shock resistance, or even failure, seriously affects the service life and reliability of electronic devices

[0003] In the prior art, the thermal expansion coefficient of the composite material is generally reduced by adding a low expansion coefficient inorganic filler particle, but the thermal expansion is still relatively high

Adding a large amount of inorganic filler particles to achieve a low thermal expansion coefficient will cause a series of problems such as brittleness of the material, filler agglomeration, and increased defects.

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