Method and structure for preventing soldering pad stripping

Abstract

A manufacturing method that avoids stripping welding pad provides a semiconductive substrate comprising a formed active circuit structure, and a dielectric with an opening is formed on the semiconductive substrate, and the opening is formed in the dielectric above the edge of the active circuit, and part of the surface of the active circuit structure is exposed. Then the welding pad is formed above the semiconductive substrate to electrically connect the active circuit structure, wherein, the welding pad covers the dielectric above the active circuit structure and fills the opening, thus forming a protective layer to cover the surface of the dielectric layer and the edge of the welding pad.

Description

technical field [0001] The invention relates to a welding pad technology of an integrated circuit, in particular to a manufacturing method and a structure for preventing the peeling off of the welding pad. Background technique [0002] Generally speaking, the metal pad layer formed on the surface of the semiconductor device is used as the connection interface between the internal circuit and the external signal, and the metal pad layer is electrically connected to the internal circuit. In the packaging technology of semiconductor components, when the integrated circuit components are completed, the wafer must be cut into dies one by one through the step of cutting, and then continue to carry out the die bonding step, and then use wire bonding ( Wire bonding) uses gold (Au) metal wires to complete the electrical connection between the external circuit and the pad metal layer, and then performs the sealing step to complete the entire semiconductor device packaging process. ...

AI Technical Summary

Problems solved by technology

Therefore, when the wire bonding process (or welding process) is performed on the pad, it is easy to cause the pad metal layer to bear excessive stress due to improper parameter control, resulting in peeling of the pad metal layer, thereby damaging the pad metal layer. elements below the layer

[0004] In particular, with the continuous development of the process, the use of the pad metal layer of the fine pitch wire bonding method will cause the problem of peeling of the pad metal layer to become more serious.

Therefore, how to avoid the problem of peeling off of the metal pad metal layer due to excessive stress in the packaging process of semiconductor components, thereby affecting the process yield, has become the goal of the current industry.

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